电子技术
電子技術
전자기술
ELECTRONIC TECHNOLOGY
2013年
3期
18-20
,共3页
非接触电能传输%线圈模型%耦合效率
非接觸電能傳輸%線圈模型%耦閤效率
비접촉전능전수%선권모형%우합효솔
contactless power supply%coil model%coupling efficiency
文章的目标是讨论影响非接触式供电系统中初、次级线圈耦合效率的几种因素.先介绍了基于PCB(Printed Circuit Board)的非接触供电系统的基本结构,然后提出了影响初、次级耦合效率的几种因素,在此基础上设计了几种仿真方案,在Is-Spice仿真环境下,对几种仿真方案进行了仿真,并给出了结果.
文章的目標是討論影響非接觸式供電繫統中初、次級線圈耦閤效率的幾種因素.先介紹瞭基于PCB(Printed Circuit Board)的非接觸供電繫統的基本結構,然後提齣瞭影響初、次級耦閤效率的幾種因素,在此基礎上設計瞭幾種倣真方案,在Is-Spice倣真環境下,對幾種倣真方案進行瞭倣真,併給齣瞭結果.
문장적목표시토론영향비접촉식공전계통중초、차급선권우합효솔적궤충인소.선개소료기우PCB(Printed Circuit Board)적비접촉공전계통적기본결구,연후제출료영향초、차급우합효솔적궤충인소,재차기출상설계료궤충방진방안,재Is-Spice방진배경하,대궤충방진방안진행료방진,병급출료결과.
The purpose of this paper is to discuss the impact factors affecting the coupling efficiency of the primary and secondary coils in the contactless power supply system. First, the basic structure of the contactless power supply system based on PCB (Printed Circuit Board) is introduced, and then several factors affecting primary and secondary coupling efficiency are proposed. On this basis several simulation schemes are designed, in Is-Spice simulation environment, several simulation schemes are simulated, and the results are given.