CAJ | 학술논문

金属熔体的黏度和表面张力都是与液态结构相关的敏感物理性质, 且存在一定的相互关系. 对于微电子封装材料而言, 黏度和表面张力均是影响其工艺性能的重要参量. 本文利用回转振动式高温熔体黏度仪测量了 Sn-xCu (x = 0.7, 1.5, 2) 钎料熔体在不同温度下的黏度值, 发现在一定温度范围内钎料熔体的黏度值存在突变, 可划分为低温区和高温区. 在各温区内, 黏温关系很好地符合 Arrhenius 方程, 在此基础上讨论了液态钎料的结构特征和演变规律. 同时, 利用黏度值计算了液态 Sn-xCu 钎料在相应温度下的表面张力, 并通过 Sn-xCu 钎料在 Cu 基板上的润湿铺展实验对计算结果进行验证. 结果显示, 润湿角和扩展率的测试结果与表面张力的计算结果具有很好的一致性, 表明通过熔体黏度值来计算锡基二元无铅钎料合金表面张力并评估其润湿性能的方法是可行的.
금속용체적점도화표면장력도시여액태결구상관적민감물이성질, 차존재일정적상호관계. 대우미전자봉장재료이언, 점도화표면장력균시영향기공예성능적중요삼량. 본문이용회전진동식고온용체점도의측량료 Sn-xCu (x = 0.7, 1.5, 2) 천료용체재불동온도하적점도치, 발현재일정온도범위내천료용체적점도치존재돌변, 가화분위저온구화고온구. 재각온구내, 점온관계흔호지부합 Arrhenius 방정, 재차기출상토론료액태천료적결구특정화연변규률. 동시, 이용점도치계산료액태 Sn-xCu 천료재상응온도하적표면장력, 병통과 Sn-xCu 천료재 Cu 기판상적윤습포전실험대계산결과진행험증. 결과현시, 윤습각화확전솔적측시결과여표면장력적계산결과구유흔호적일치성, 표명통과용체점도치래계산석기이원무연천료합금표면장력병평고기윤습성능적방법시가행적.
The viscosity and surface tension of metal melt are all sensitive physical properties that relate to the liquid structure and also have a certain correlation between them. For electronic packaging materials, both viscosities and surface tensions are very important parameters affecting the processing properties. In this study, the viscosities of Sn-xCu (x = 0.7, 1.5, 2) solder melts are measured by using a torsional oscillation high-temperature viscometer. Abrupt change in viscosity occurrs in a certain range of temperature. The temperature range can accordingly be divided into a low temperature zone and a high temperature zone. The relationship between viscosity and temperature can fit to the Arrhenius equation very well in each temperature zone. The structure characteristics and evolutions of the liquid solders are then discussed. Meanwhile, the surface tensions of the Sn-xCu solders are calculated according to the viscosity values at the corresponding temperatures. The test results of the wetting angle and the spreading rate are in good agreement with the calculations, indicating that the method of using the viscosity values to calculate the surface tensions of binary lead-free solder alloys and evaluate their wettabilities is feasible.