CAJ | 학술논문

采用双臂电桥法测量了不同氧化程度的裸铜框架的电阻,在此基础上分析了烘箱内氧浓度、烘烤温度和框架表面镀铜厚度对框架氧化程度的影响.研究发现,在氧浓度≤0.1%的氮气保护环境中,经过180℃烘烤60 min后,裸铜框架的氧化程度大于无氮气保护下100℃烘烤60 min后的氧化程度;镀铜层能有效提高裸铜框架在100~180℃范围内的抗氧化能力,镀铜层较厚(1.0μm)的裸铜框架的抗氧化能力优于镀铜层较薄(0.5μm)的裸铜框架的抗氧化能力.
채용쌍비전교법측량료불동양화정도적라동광가적전조,재차기출상분석료홍상내양농도、홍고온도화광가표면도동후도대광가양화정도적영향.연구발현,재양농도≤0.1%적담기보호배경중,경과180℃홍고60 min후,라동광가적양화정도대우무담기보호하100℃홍고60 min후적양화정도;도동층능유효제고라동광가재100~180℃범위내적항양화능력,도동층교후(1.0μm)적라동광가적항양화능력우우도동층교박(0.5μm)적라동광가적항양화능력.
In this paper, using double bridge method, the resistances of bare-copper leadframes with different degrees of oxidation were measured. Based on these measurements, effects of oxygen concentration, baking temperature and thickness of copper coating on oxidation of bare-copper leadframe were studied. This study results show that the oxidation of bare-copper leadframe were baked at the temperature of 180℃for 60 min under oxygen concentration of 0.1%within Nitrogen environment is more serious than which was caused by baking at the temperature of 100℃for 60 min under atmosphere. Moreover, copper coating can effectively improve the oxidation resistance of bare-copper leadframe at the range of 100~180℃, and the oxidation resistance of bare-copper leadframe with 1.0μm copper coating is superior to that of another bare-copper leadframe with 0.5μm copper coating.