CAJ | 학술논문

采用模压成型和无压浸渗工艺制备了高体积分数 SiC 增强 Al 基复合材料(AlSiC),对其物相和显微结构进行研究.结果表明:用上述方法制备的 AlSiC 复合材料组织致密,两种粒径的 SiC 颗粒均匀分布于 Al 基质中,界面结合强度高;SiC 增强颗粒与 Al 基质界面反应控制良好,未出现 Al4C3等脆性相.分析指出:Al 合金中 Si元素的存在有利于防止脆性相 Al4C3的形成,Mg 元素的加入提高了 Al 基体和 SiC 增强体之间的润湿性.所获得复合材料的平均热膨胀系数为9.31×10?6 K?1,热导率为238 W/(m?K),密度为2.97 g/cm3,表现出了良好的性能,完全满足高性能电子封装材料的要求.
채용모압성형화무압침삼공예제비료고체적분수 SiC 증강 Al 기복합재료(AlSiC),대기물상화현미결구진행연구.결과표명:용상술방법제비적 AlSiC 복합재료조직치밀,량충립경적 SiC 과립균균분포우 Al 기질중,계면결합강도고;SiC 증강과립여 Al 기질계면반응공제량호,미출현 Al4C3등취성상.분석지출:Al 합금중 Si원소적존재유리우방지취성상 Al4C3적형성,Mg 원소적가입제고료 Al 기체화 SiC 증강체지간적윤습성.소획득복합재료적평균열팽창계수위9.31×10?6 K?1,열도솔위238 W/(m?K),밀도위2.97 g/cm3,표현출료량호적성능,완전만족고성능전자봉장재료적요구.
@@@@The SiC reinforced Al matrix composite (AlSiC) with high SiC volume fraction was prepared by combination of compression molding for SiC preform and pressureless infiltration. The microstructure and phase of AlSiC composite were studied. The results show that the AlSiC composite fabricated by above-mentioned methods is free of porosity, the SiC particles with two sizes are distributed uniformly, and the high interfacial bonding strength is achieved. Moreover, the interfacial reaction is well controlled so that some harm phases especially Al4C3 fragility phase are absence from interfacial reaction products. The physical mechanism behind those experimental phenomena was analyzed in detail. The existence of silicon in the aluminum alloy prevents the formation of Al4C3 fragility phase and the addition of magnesium to the aluminum alloy significantly improves the wetting property of SiC with aluminum. The thermal expansion coefficient of AlSiC composite is 9.31×10?6 K?1, the thermal conductivity is 238 W/(m?K), and the density is 2.97 g/cm3. The AlSiC composite exhibits excellent properties and can fully meets the requirements of high-end electronic packaging materials.