CAJ | 학술논문

研究 Cu/Sn/Ni 焊点在250℃液?固界面反应过程中 Cu-Ni 交互作用对界面反应的影响.结果表明:液?固界面反应10 min 后,Cu-Ni 交互作用就已经发生,Sn/Cu 及 Sn/Ni 界面金属间化合物(IMCs)由浸焊后的 Cu6Sn5和 Ni3Sn4均转变为(Cu,Ni)6Sn5,界面 IMCs 形貌也由扇贝状转变为短棒状.在随后的液?固界面反应过程中,两界面 IMCs 均保持为(Cu,Ni)6Sn5类型,但随着反应的进行,界面 IMC 的形貌变得更加凸凹不平.Sn/Cu 和 Sn/Ni 界面 IMCs 厚度均随液?固界面反应时间的延长不断增加,界面 IMCs 生长指数分别为0.32和0.61.在液?固界面反应初始阶段,Sn/Cu 界面 IMC 的厚度大于 Sn/Ni 界面 IMC 的厚度;液?固界面反应2 h 后,由于 Cu-Ni 交互作用, Sn/Cu 界面 IMC 的厚度要小于 Sn/Ni 界面 IMC 的厚度,并在液?固界面反应6 h 后分别达到15.78和23.44μm.
연구 Cu/Sn/Ni 한점재250℃액?고계면반응과정중 Cu-Ni 교호작용대계면반응적영향.결과표명:액?고계면반응10 min 후,Cu-Ni 교호작용취이경발생,Sn/Cu 급 Sn/Ni 계면금속간화합물(IMCs)유침한후적 Cu6Sn5화 Ni3Sn4균전변위(Cu,Ni)6Sn5,계면 IMCs 형모야유선패상전변위단봉상.재수후적액?고계면반응과정중,량계면 IMCs 균보지위(Cu,Ni)6Sn5류형,단수착반응적진행,계면 IMC 적형모변득경가철요불평.Sn/Cu 화 Sn/Ni 계면 IMCs 후도균수액?고계면반응시간적연장불단증가,계면 IMCs 생장지수분별위0.32화0.61.재액?고계면반응초시계단,Sn/Cu 계면 IMC 적후도대우 Sn/Ni 계면 IMC 적후도;액?고계면반응2 h 후,유우 Cu-Ni 교호작용, Sn/Cu 계면 IMC 적후도요소우 Sn/Ni 계면 IMC 적후도,병재액?고계면반응6 h 후분별체도15.78화23.44μm.
@@@@The effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn/Ni solder joint at 250℃ was investigated. The results show that the Cu-Ni cross-solder interaction occurs after liquid-solid reaction for 10 min, the initial Cu6Sn5 and Ni3Sn4 form during immersing soldering at the Sn/Cu and Sn/Ni interfaces, and both transform into (Cu,Ni)6Sn5, their morphologies change from scallop shape to rod shape. With increasing reaction time, the interfacial IMCs remain as (Cu,Ni)6Sn5, while their morphologies become more uneven. The IMCs at the Sn/Cu and Sn/Ni interfaces grow thicker with increasing reaction time, and their growth indexes are 0.32 and 0.61, respectively. At the beginning of the liquid-solid reaction, the Sn/Cu interfacial IMC is thicker than the Sn/Ni interfacial IMC. However, after liquid-solid reaction for 2 h, the result reverses due to the Cu-Ni cross-solder interaction, and the thicknesses reach 15.78 and 23.44 μm after reaction for 6 h, respectively.