电讯技术
電訊技術
전신기술
TELECOMMUNICATIONS ENGINEERING
2013年
2期
219-224
,共6页
毫米波%集成技术%SOP%小型化%综述
毫米波%集成技術%SOP%小型化%綜述
호미파%집성기술%SOP%소형화%종술
millimeter-wave%integration technology%SOP%miniaturization%summarization
介绍了SOP(System-On-Package)集成技术,并与传统系统集成方法以及SOC(System-On-Chip)、MIP(Module-In-Package)、MCM(Multi-Chip-Module)、SIP(System-In-Package)等微封装、微集成技术进行了比较和分析,揭示了SOP小型化、低成本、高可靠性、高性能特点.对SOP在毫米波系统应用、新材料和新工艺的进展进行了总结,结果表明SOP在毫米波系统中具有良好的应用前景.
介紹瞭SOP(System-On-Package)集成技術,併與傳統繫統集成方法以及SOC(System-On-Chip)、MIP(Module-In-Package)、MCM(Multi-Chip-Module)、SIP(System-In-Package)等微封裝、微集成技術進行瞭比較和分析,揭示瞭SOP小型化、低成本、高可靠性、高性能特點.對SOP在毫米波繫統應用、新材料和新工藝的進展進行瞭總結,結果錶明SOP在毫米波繫統中具有良好的應用前景.
개소료SOP(System-On-Package)집성기술,병여전통계통집성방법이급SOC(System-On-Chip)、MIP(Module-In-Package)、MCM(Multi-Chip-Module)、SIP(System-In-Package)등미봉장、미집성기술진행료비교화분석,게시료SOP소형화、저성본、고가고성、고성능특점.대SOP재호미파계통응용、신재료화신공예적진전진행료총결,결과표명SOP재호미파계통중구유량호적응용전경.
@@@@In this paper,System-On-Package(SOP)is introduced. SOP is compared with traditional system inte-gration technology and other types of integration technology,such as System-On-Chip(SOC),Module-In-Package (MIP),Multi-Chip-Module(MCM)and System-In-Package(SIP).On this base,it is illustrated that SOP is fea-tured by miniaturization,low cost,high reliability and high performance. And the progress of SOP in millimeter-wave system application,new material and new manufacture technology is analyzed. The results show that SOP has promising future in millimeter-wave systems.
