CAJ | 학술논문

清洗是CBGA封装中的一道重要工序,它对电子产品的质量和可靠性起着极为重要的作用.对于CBGA电子产品,植球后都需要进行严格有效的清洗,以去除残留助焊剂和污染物.主要介绍了CBGA植球回流焊后助焊剂清洗的基本原理,分析了清洗温度和清洗剂浓度对陶瓷基板上残留的助焊剂清洗效果的影响,并对其影响机理进行了深入剖析.结果表明,清洗温度为55℃~65℃、清洗剂浓度为8%~12%时,残留助焊剂的清洗效果最佳.
청세시CBGA봉장중적일도중요공서,타대전자산품적질량화가고성기착겁위중요적작용.대우CBGA전자산품,식구후도수요진행엄격유효적청세,이거제잔류조한제화오염물.주요개소료CBGA식구회류한후조한제청세적기본원리,분석료청세온도화청세제농도대도자기판상잔류적조한제청세효과적영향,병대기영향궤리진행료심입부석.결과표명,청세온도위55℃~65℃、청세제농도위8%~12%시,잔류조한제적청세효과최가.
Cleaning is an important process during CBGA package assembly, and it impacts the quality and reliability of electronic products. Strict and effective cleaning for CBGA of electronic product must be done to remove flux residue and pollutant after ball mounting in CBGA package. The basic principle of flux residues cleaning after ball mounting in CBGA package was introduced. The effect of cleaning temperature and concentration of solution on flux residues cleaning was investigated, and the mechanism was deeply analysised. The results indicated that the effect of flux residues cleaning was best in terms of reasonable cleaning temperature (55℃~65℃) and concentration (8%~12%).