CAJ | 학술논문

根据半导体工艺的需要,介绍了利用SEM分析工艺问题的方法.主要包括样品的解理、缀饰及为提高导电性所采用的镀膜方法比对,其中高效、准确的解理定位是重要前提.三个典型案例中,埋层漂移是在问题刚显露时就得到及时分析、彻底解决;而MEMS器件悬臂梁断裂翘曲及减少鸟嘴工艺,则是在研制开发新工艺过程之初,就列为“定点清除”的主要问题.上述问题是发生在科研生产中的实例,且均已在工艺规范层面定型.在形成成品之前,特别是工艺设计及加工制造阶段的失效分析及可靠性研究,能够在隐患转变为大面积工艺问题及后期性能参数问题之前,就能够提早定位并彻底解决,更为今后产品大规模量产及产品升级换代提供客观准确的科学依据.SEM是其中的重要技术手段,尤其在线检测分析更是物尽其用.
근거반도체공예적수요,개소료이용SEM분석공예문제적방법.주요포괄양품적해리、철식급위제고도전성소채용적도막방법비대,기중고효、준학적해리정위시중요전제.삼개전형안례중,매층표이시재문제강현로시취득도급시분석、철저해결;이MEMS기건현비량단렬교곡급감소조취공예,칙시재연제개발신공예과정지초,취렬위“정점청제”적주요문제.상술문제시발생재과연생산중적실례,차균이재공예규범층면정형.재형성성품지전,특별시공예설계급가공제조계단적실효분석급가고성연구,능구재은환전변위대면적공예문제급후기성능삼수문제지전,취능구제조정위병철저해결,경위금후산품대규모양산급산품승급환대제공객관준학적과학의거.SEM시기중적중요기술수단,우기재선검측분석경시물진기용.
According to the need of semiconductor technology, this article describes the methods of analysis technology problems by using SEM. Mainly includes sample’s cleavage, Decoration and comparison of the coating method in order to improve the conductivity, the efficient, accurate cleavage positioning is one of the important premise. Among Three typical cases, the buried layer drift has been analysis and completely solved when the question just show;the MEMS device’s cantilever beam fracture warpage and reduced beak process, is listed as the"tipping point"main problem, when the research and development of new process at the beginning. The problems are the true case which occurred in production and research, and all have been set in the process specification level. In forming the finished product before, especially in the phase of design and manufacturing , failure analysis and reliability research, can be early positioned and completely resolved, before the hidden dangers change into large area problems of process and the later performance parameters, more for the large-scale production and product upgrading of future products provide objective and accurate scientific basis. SEM is one of the important technical means, especially on-line detection and analysis.