CAJ | 학술논문

在微电子封装领域纳米导电胶越来越引人注目,因为与传统导电胶相比纳米导电胶具有特殊的电性能和力学性能.目前纳米导电胶的研究涉及采用纳米颗粒、纳米线和碳纳米管等作为导电填料制备高性能导电胶,以及采用自组装单分子膜(SAMs)技术改性各项异性导电胶互连中金属填料和金属焊盘的界面来提高互连接头电性能.概述了近年来纳米导电胶的研究进展.
재미전자봉장영역납미도전효월래월인인주목,인위여전통도전효상비납미도전효구유특수적전성능화역학성능.목전납미도전효적연구섭급채용납미과립、납미선화탄납미관등작위도전전료제비고성능도전효,이급채용자조장단분자막(SAMs)기술개성각항이성도전효호련중금속전료화금속한반적계면래제고호련접두전성능.개술료근년래납미도전효적연구진전.
Nano-conductive adhesives have been attracting more and more interest in microelectronic packaging field due to their unique electrical and mechanical properties compared to conventional conductive adhesives. There has been extensive research on electrical conductive adhesives with nanotechnologies, such as introducing nano-particles, nano-wires, carbon nano-tubes or graphene into conductive fillers and introducing self-assembled molecular wires (SAM) into the interface between metal fillers and metal-finished bond pad of ACAs. provide a comprehensive review of most recent advances in nano-conductive adhesives.