CAJ | 학술논문

电迁移问题作为影响焊点可靠性的关键问题之一,容易导致焊点出现裂纹、丘凸和空洞等焊接缺陷.其失效机制有电流拥挤效应、焦耳热效应、极化效应和金属间化合物失效等.聚焦Sn-Ag-Cu系无铅钎料焊点的电迁移问题,介绍了这一领域电迁移的失效机制、影响因素和防止措施的研究现状,并展望了今后的研究发展趋势.
전천이문제작위영향한점가고성적관건문제지일,용역도치한점출현렬문、구철화공동등한접결함.기실효궤제유전류옹제효응、초이열효응、겁화효응화금속간화합물실효등.취초Sn-Ag-Cu계무연천료한점적전천이문제,개소료저일영역전천이적실효궤제、영향인소화방지조시적연구현상,병전망료금후적연구발전추세.
As one of the key issues affecting the solder joint reliability, electro-migration problems can cause the failure in the form of solder joints crack, mound convex, voids and other defects. The failure mechanisms include current crowding effect, joule heating, polarization effects, and intermetallic compounds, and so on. Focused on the electromigration problems of Sn-Ag-Cu lead-free solder, comprehensively describe the failure modes, influencing factors and preventing measures of this area and outlook of its future research trends.