CAJ | 학술논문

在笔记本生产行业,BGA焊点内存在气泡是一种普遍并且难以避免的现象.选用不同球径及合金成分的BGA进行回流焊,观察焊点内气泡的分布情况.结果发现,BGA内外部的温差会导致元件四个角落以及边缘比内部的气泡率大;此外BGA锡球与锡膏熔融时产生的时间差也会对气泡率的大小产生影响.该发现为产线有效降低气泡率提供了有力的依据,同时对PCB电路设计也具有一定的参考价值.
재필기본생산행업,BGA한점내존재기포시일충보편병차난이피면적현상.선용불동구경급합금성분적BGA진행회류한,관찰한점내기포적분포정황.결과발현,BGA내외부적온차회도치원건사개각락이급변연비내부적기포솔대;차외BGA석구여석고용융시산생적시간차야회대기포솔적대소산생영향.해발현위산선유효강저기포솔제공료유력적의거,동시대PCB전로설계야구유일정적삼고개치.
In the notebook manufacturing industry, void is a universal phenomenon in the solder joint, and it is difficult to eliminate. Observe the void distribution in the BGAs which have different ball-diameter and alloy composition. The results show that the different temperature between BGA external and inside will lead to void varying. The void rate in four corners and edges is higher than that of the inside. Besides, the melting time difference between BGA solder ball and solder paste also has impact on void rate. This discovery provides a strong basis for the production line effectively reduce the void rate. It also has certain reference value for PCB circuit design.