CAJ | 학술논문

在硅抛光片的清洗技术中,湿法清洗技术仍然是主流清洗技术.随着抛光片尺寸增大,传统的手工清洗方式和半自动清洗方式已经不适于大尺寸硅抛光片的清洗,因此全自动湿法清洗设备逐步在大尺寸硅抛光片清洗设备中占据主导地位.在湿法清洗工艺中,夹具形状对清洗槽中液体的流动有着较大的影响,若夹具形状设计不合理,将影响抛光片表面沾污的去除,在抛光片表面形成“色斑”缺陷.
재규포광편적청세기술중,습법청세기술잉연시주류청세기술.수착포광편척촌증대,전통적수공청세방식화반자동청세방식이경불괄우대척촌규포광편적청세,인차전자동습법청세설비축보재대척촌규포광편청세설비중점거주도지위.재습법청세공예중,협구형상대청세조중액체적류동유착교대적영향,약협구형상설계불합리,장영향포광편표면첨오적거제,재포광편표면형성“색반”결함.
In the silicon wafer cleaning technology, wet cleaning technology is still the mainstream cleaning technology. With the polishing sheet size increases, the traditional manual cleaning methods and semi automatic cleaning method is not suitable for large size silicon wafer cleaning, thus automatic wet cleaning equipment occupies the main position gradually in large size silicon wafer cleaning. In the wet cleaning process, jig shape has a greater impact on the flow of the liquid in the cleaning tank, if the jig shape design is unreasonable, the stain defect would be observed on the polished wafers.