光电技术应用
光電技術應用
광전기술응용
ELECTRO-OPTIC WARFARE & RADAR PASSIVE COUNTERMEASURES
2012年
6期
75-79
,共5页
热功耗%热流密度%机箱%热仿真%ANSYS Icepak软件
熱功耗%熱流密度%機箱%熱倣真%ANSYS Icepak軟件
열공모%열류밀도%궤상%열방진%ANSYS Icepak연건
thermal-power consumption%heat flux density%chassis%thermal simulation%ANSYA Icepak software
根据机箱热载荷等边界要求,对密闭机箱中的电子功能模块的热功耗和机箱热稳态下散热表面的热流密度进行了分析和计算.通过计算机箱与外部空气自然对流冷却下的热流密度值来分析机箱的整体散热性能,并将计算结果与空气自然对流散热的热流密度阈值进行比较;在此基础上使用建模软件UG NX7.5完成机箱的CAD数字样机建模;使用ANSYS Icepak有限元热仿真分析软件进行CFD(计算流体动力学分析)和热仿真分析,完成了机箱参数设定、网格划分,对机箱进行精确的热仿真计算,验证机箱热设计的可靠性,为其他同类电子设备热仿真分析与散热优化设计提供了参考.
根據機箱熱載荷等邊界要求,對密閉機箱中的電子功能模塊的熱功耗和機箱熱穩態下散熱錶麵的熱流密度進行瞭分析和計算.通過計算機箱與外部空氣自然對流冷卻下的熱流密度值來分析機箱的整體散熱性能,併將計算結果與空氣自然對流散熱的熱流密度閾值進行比較;在此基礎上使用建模軟件UG NX7.5完成機箱的CAD數字樣機建模;使用ANSYS Icepak有限元熱倣真分析軟件進行CFD(計算流體動力學分析)和熱倣真分析,完成瞭機箱參數設定、網格劃分,對機箱進行精確的熱倣真計算,驗證機箱熱設計的可靠性,為其他同類電子設備熱倣真分析與散熱優化設計提供瞭參攷.
근거궤상열재하등변계요구,대밀폐궤상중적전자공능모괴적열공모화궤상열은태하산열표면적열류밀도진행료분석화계산.통과계산궤상여외부공기자연대류냉각하적열류밀도치래분석궤상적정체산열성능,병장계산결과여공기자연대류산열적열류밀도역치진행비교;재차기출상사용건모연건UG NX7.5완성궤상적CAD수자양궤건모;사용ANSYS Icepak유한원열방진분석연건진행CFD(계산류체동역학분석)화열방진분석,완성료궤상삼수설정、망격화분,대궤상진행정학적열방진계산,험증궤상열설계적가고성,위기타동류전자설비열방진분석여산열우화설계제공료삼고.
According to the identical border requirement of thermal loads in a chassis, the thermal-power consumption of electronic function modules and the heat flux density of a thermal runaway surface at thermal sta?bility state are analyzed and calculated. The integral thermal runaway characteristic is analyzed by calculating the hot flow density value which is from cooled natural convection air between the chassis and outside. And the re?sults are compared with the hot flow density threshold of air natural convection thermal runaway. Based on this, the simulation of CAD numerical sample is completed by simulation software UG NX7.5. CFD and thermal simu?lation analysis are performed by thermal simulation analysis software of ANSYS Icepak limited elements. Param?eters assumption and grids plotting of the chassis are completed. Accurate calculations of thermal simulations are performed to validate the thermal design reliability of the chassis and provide references for thermal simulation analysis and thermal runaway optimum design of other similar electronic equipment.