CAJ | 학술논문

在质量分数30%有机膦酸(HEDP)和0.02 mol/L苯骈三氮唑(BTA)电解液中,模拟实验研究静、动下电压对铜的电化学机械平整化材料去除率和表面质量的影响规律.实验结果表明,铜在30%HEDP+0.02 mol/L BTA电解液中的钝化电压区间为0.2~1.1 V,当阳极电势为0.5 V时,BTA的腐蚀抑制效率接近90%;静、动态下铜的料去除率均随施加电压的增大而增大,但施加电压过大,铜表面出现腐蚀坑;在不降低表面质量的前提下,当外界施电压0.5 V时,能较好地平衡电化学作用与机械作用,达到较高的材料去除率.
재질량분수30%유궤련산(HEDP)화0.02 mol/L분병삼담서(BTA)전해액중,모의실험연구정、동하전압대동적전화학궤계평정화재료거제솔화표면질량적영향규률.실험결과표명,동재30%HEDP+0.02 mol/L BTA전해액중적둔화전압구간위0.2~1.1 V,당양겁전세위0.5 V시,BTA적부식억제효솔접근90%;정、동태하동적료거제솔균수시가전압적증대이증대,단시가전압과대,동표면출현부식갱;재불강저표면질량적전제하,당외계시전압0.5 V시,능교호지평형전화학작용여궤계작용,체도교고적재료거제솔.
To explore the mechanism of voltage on material removal rate and surface quality,Cu-ECMP simulating ex-periments were carried out for rubbing pairs of Si3 N4/Cu in electrolyte of 30%HEDP+0.02 mol/L BTA,in dynamic and static state. Experimental results show that the passivating region is between 0.2 V and 1.1 V for Cu in electrolyte of 30%HEDP+0.02 mol/L BTA. When anode potential is 0.5 V,the Inhibition Efficiency(IE)even come near to 90%. Material removal rate increases with the increase of voltage in both dynamic and static state. However,the etch pit will apper when voltage is higher. Perfect balance between electrochemical and mechanical action could be obtained when we apply annodic voltage of 0.5 V,and the Material Removal Rate(MRR)reaches quite high,without reducing the surface quality.