电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
3期
13-15
,共3页
还原气氛%金属化%可焊性%溶蚀%润湿性
還原氣氛%金屬化%可銲性%溶蝕%潤濕性
환원기분%금속화%가한성%용식%윤습성
reducing atmosphere%metallization%solderability%dissolution%wetting
采用还原气氛焊接,研究了LTCC基板的表面金属化工艺对In-Sn、Pb-Sn和Au-Sn焊料可焊性的影响.结果表明厚膜烧结的PdAg导体可焊性较差,In-Sn和Pb-Sn焊料在其表面分别出现了不润湿和溶蚀现象.通过对LTCC基板表面导体进行电镀改性,Cu/Ni/Au镀层提高了Pb-Sn和Au-Sn焊料的可焊性,而Cu/Ni/Sn镀层则提高了In-Sn和Pb-Sn焊料的可焊性.最后,对提高可焊性的因素进行了讨论.
採用還原氣氛銲接,研究瞭LTCC基闆的錶麵金屬化工藝對In-Sn、Pb-Sn和Au-Sn銲料可銲性的影響.結果錶明厚膜燒結的PdAg導體可銲性較差,In-Sn和Pb-Sn銲料在其錶麵分彆齣現瞭不潤濕和溶蝕現象.通過對LTCC基闆錶麵導體進行電鍍改性,Cu/Ni/Au鍍層提高瞭Pb-Sn和Au-Sn銲料的可銲性,而Cu/Ni/Sn鍍層則提高瞭In-Sn和Pb-Sn銲料的可銲性.最後,對提高可銲性的因素進行瞭討論.
채용환원기분한접,연구료LTCC기판적표면금속화공예대In-Sn、Pb-Sn화Au-Sn한료가한성적영향.결과표명후막소결적PdAg도체가한성교차,In-Sn화Pb-Sn한료재기표면분별출현료불윤습화용식현상.통과대LTCC기판표면도체진행전도개성,Cu/Ni/Au도층제고료Pb-Sn화Au-Sn한료적가한성,이Cu/Ni/Sn도층칙제고료In-Sn화Pb-Sn한료적가한성.최후,대제고가한성적인소진행료토론.
@@@@The effects of surface Metalizing Techniques on solderabilities of solder, such as In-Sn, Pb-Sn and Au-Sn, were investigated using reducing atmosphere soldering. The results shown that the solderabilities were very poor on the PdAg conductor sintered through thick film technology, The nonwetting and dissolution was arisen in In-Sn and Pb-Sn solder respectively. The solderability of Pb-Sn and Au-Sn solder were improved by electroplating Cu/Ni/Au trilay surface finish of LTCC substrate. While that of In-Sn and Pb-Sn were improved by Cu/Ni/Sn trilay surface finish. Finally, the factors for improving solderability were discussed.
