绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2013年
1期
22-26
,共5页
苯并噁嗪%共混%工艺性能%介电性能%氢键
苯併噁嗪%共混%工藝性能%介電性能%氫鍵
분병오진%공혼%공예성능%개전성능%경건
benzoxazine%blend%processability%dielectric property%hydrogen bonding
合成了对氨基苯炔丙基醚(appe),与苯酚和多聚甲醛通过 Mannich 反应制备了含炔丙基的苯并噁嗪(P-appe).将 P-appe 与苯酚/苯胺型苯并噁嗪(PAF)采用溶液共混的方法制得了共混苯并噁嗪树脂,研究了PAF和P-appe共混树脂的工艺性以及温度对其固化树脂介电性能的影响.结果表明:共混树脂粘度小于50 mPa·s,加工窗口为80~200℃.共混树脂凝胶过程的活化能为102.1 kJ/mol,固化树脂的吸水率低于0.44%.共混树脂的介电常数随温度升高而上升,介质损耗随频率的增加出现的峰值随温度上升而移向高频.固化树脂分子内氢键(-OH···N)含量随温度的升高而提高.
閤成瞭對氨基苯炔丙基醚(appe),與苯酚和多聚甲醛通過 Mannich 反應製備瞭含炔丙基的苯併噁嗪(P-appe).將 P-appe 與苯酚/苯胺型苯併噁嗪(PAF)採用溶液共混的方法製得瞭共混苯併噁嗪樹脂,研究瞭PAF和P-appe共混樹脂的工藝性以及溫度對其固化樹脂介電性能的影響.結果錶明:共混樹脂粘度小于50 mPa·s,加工窗口為80~200℃.共混樹脂凝膠過程的活化能為102.1 kJ/mol,固化樹脂的吸水率低于0.44%.共混樹脂的介電常數隨溫度升高而上升,介質損耗隨頻率的增加齣現的峰值隨溫度上升而移嚮高頻.固化樹脂分子內氫鍵(-OH···N)含量隨溫度的升高而提高.
합성료대안기분결병기미(appe),여분분화다취갑철통과 Mannich 반응제비료함결병기적분병오진(P-appe).장 P-appe 여분분/분알형분병오진(PAF)채용용액공혼적방법제득료공혼분병오진수지,연구료PAF화P-appe공혼수지적공예성이급온도대기고화수지개전성능적영향.결과표명:공혼수지점도소우50 mPa·s,가공창구위80~200℃.공혼수지응효과정적활화능위102.1 kJ/mol,고화수지적흡수솔저우0.44%.공혼수지적개전상수수온도승고이상승,개질손모수빈솔적증가출현적봉치수온도상승이이향고빈.고화수지분자내경건(-OH···N)함량수온도적승고이제고.
A p-aminophenyl propargyl ether(appe) was synthesized, and a propargyl based benzoxazine (P-appe) was prepared with the appe, phenol and paraformaldehyde by Mannich condensation reaction. A benzoxazine blend(PAF/P-appe) was prepared by blending the P-appe and phenol/aniline-based benzoxazine (PAF) in solution, and the processibility of the PAF and P-appe blend resin and the effect of tempera-ture on the dielectric properties of the cured resin were studied. The results show that the viscosity of the blend resin is lower than 50 mPa·s with the processing window at 80~200 ℃. The activity energy of the blend resin in gel process is 102.1 kJ/mol, and the water absorption of the cured resin is lower than 0.44%. With the increase of temperature, the dielectric constant of the cured resin increases, the peak tand of the cured resin shifts to higher frequency, and the content of intramolecular hydrogen bonding (-OH···N) in the cured resin increases.