CAJ | 학술논문

通过热应力实验、SEM、EDX、金相切片分析等方法对HDI板生产中易出现分层的各环节进行了探究,结果表明:半固化片储存时吸潮、塞孔后树脂未除净、棕化后清洗用的DI水pH值较低、压合时受力不均是HDI板制造中引起分层的主要原因,并给出了相应的改进措施,提高了产品合格率.
통과열응력실험、SEM、EDX、금상절편분석등방법대HDI판생산중역출현분층적각배절진행료탐구,결과표명:반고화편저존시흡조、새공후수지미제정、종화후청세용적DI수pH치교저、압합시수력불균시HDI판제조중인기분층적주요원인,병급출료상응적개진조시,제고료산품합격솔.
The reasons for delamination of HDI board in its manufacture process have been analyzed in this paper. The results demonstrated that the moisture absorption of prepreg in storage, the unclean of SiO2 after filling hole, the lower PH value of DI water and the unevenness of timely pressure were the important reasons for delamination of HDI board. Meanwhile, the corresponding improvement measures were given in this paper and the rate of qualified products was improved.