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2013年
2期
53-58
,共6页
硅玻璃互连板%集成无源元件(IPD)%Si系芯片元件%无Si化
硅玻璃互連闆%集成無源元件(IPD)%Si繫芯片元件%無Si化
규파리호련판%집성무원원건(IPD)%Si계심편원건%무Si화
Si/Glass Base Interposer%Integrated Passive Device(IPD)%Si base Chip Device%Silicon Free
概述了硅玻璃互连板和硅系集成无源元件(IPD)的动向.无源元件制造商的PCB嵌入用硅系芯片元件已经问世.硅基板上的微细薄膜线路和薄膜元件实现无硅化.
概述瞭硅玻璃互連闆和硅繫集成無源元件(IPD)的動嚮.無源元件製造商的PCB嵌入用硅繫芯片元件已經問世.硅基闆上的微細薄膜線路和薄膜元件實現無硅化.
개술료규파리호련판화규계집성무원원건(IPD)적동향.무원원건제조상적PCB감입용규계심편원건이경문세.규기판상적미세박막선로화박막원건실현무규화.
This paper describes the trend of Si/glass base interposer and Si base integrated passive device(IPD). Si base chip devices for PCB embedded with passive component has been in practice. Fine film wiring and fine film devices on Si base Substrates are realized silicon free.
