印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
2期
59-63
,共5页
透明挠性基板%大面积电子%铜芯插入基板%创新
透明撓性基闆%大麵積電子%銅芯插入基闆%創新
투명뇨성기판%대면적전자%동심삽입기판%창신
Transparent Flexible Substrate%Large Area Electronics%Copper Core Insert Substrate%Innovation
概述了由PET,高耐热树脂和铜箔组成的透明挠性基板“SPET”的开发,生产,特征和应用以及今后的展开.
概述瞭由PET,高耐熱樹脂和銅箔組成的透明撓性基闆“SPET”的開髮,生產,特徵和應用以及今後的展開.
개술료유PET,고내열수지화동박조성적투명뇨성기판“SPET”적개발,생산,특정화응용이급금후적전개.
This paper describes the development, production, characteristic and application of transparent flexible substrate“SPET” Composed of PET, high heat resistance resin and copper foil. It also discuss the application in the future.
