电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
3期
1-8
,共8页
宗飞%王志杰%徐艳博%叶德洪%舒爱鹏%陈泉
宗飛%王誌傑%徐豔博%葉德洪%舒愛鵬%陳泉
종비%왕지걸%서염박%협덕홍%서애붕%진천
引线键合%时序%参数%劈刀设计%键合机理%工艺问题%铜线
引線鍵閤%時序%參數%劈刀設計%鍵閤機理%工藝問題%銅線
인선건합%시서%삼수%벽도설계%건합궤리%공예문제%동선
wire bond%procedure%parameter%capillary design%joining mechanism%bonding issue%copper
文章通过总结众多相关文献的研究成果和实际引线键合工艺中的经验心得,为读者呈现较全面的有关引线键合的介绍,包括键合时序、机台动作、关键键合参数、键合材料特性、键合工具的设计、键合机理等方面.在对一些常见的工艺问题(如不烧球、高尔夫焊点、短线尾、焊点不粘等)分析的基础上,讨论其解决方案和最近研究进展;同时也关注了铜引线键合技术发展中存在的一些问题.由于作者能力及文章篇幅的限制,仅对关键工艺及因素进行了探讨,希望能帮助读者深入了解引线键合工艺,并对实际工艺问题的解决和键合理论机理的研究有所益处.
文章通過總結衆多相關文獻的研究成果和實際引線鍵閤工藝中的經驗心得,為讀者呈現較全麵的有關引線鍵閤的介紹,包括鍵閤時序、機檯動作、關鍵鍵閤參數、鍵閤材料特性、鍵閤工具的設計、鍵閤機理等方麵.在對一些常見的工藝問題(如不燒毬、高爾伕銲點、短線尾、銲點不粘等)分析的基礎上,討論其解決方案和最近研究進展;同時也關註瞭銅引線鍵閤技術髮展中存在的一些問題.由于作者能力及文章篇幅的限製,僅對關鍵工藝及因素進行瞭探討,希望能幫助讀者深入瞭解引線鍵閤工藝,併對實際工藝問題的解決和鍵閤理論機理的研究有所益處.
문장통과총결음다상관문헌적연구성과화실제인선건합공예중적경험심득,위독자정현교전면적유관인선건합적개소,포괄건합시서、궤태동작、관건건합삼수、건합재료특성、건합공구적설계、건합궤리등방면.재대일사상견적공예문제(여불소구、고이부한점、단선미、한점불점등)분석적기출상,토론기해결방안화최근연구진전;동시야관주료동인선건합기술발전중존재적일사문제.유우작자능력급문장편폭적한제,부대관건공예급인소진행료탐토,희망능방조독자심입료해인선건합공예,병대실제공예문제적해결화건합이론궤리적연구유소익처.
@@@@This paper attempted to integrate both reviewing on recent literatures and actual experiences in wire bonding process and provide a comprehensive review on bonding procedure, bonder motions, key bonding parameters, properties of bonding materials, designs of bonding tools as well as joining mechanism. At the same time some issues such as EFO-open, golf bond, short tail, non-stick on pad and lead were analysed; the solutions and recent developments to these issues were discussed. In addition, the application and special points of copper wire in wire bonding were also focused on. Because of the limitation of paper page, only key process factors were reviewed briefly; while this paper provided an opportunity to understand wire bonding well and brought a great benefit to the solving of whether actual operation issues or basic bonding principles.