印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
z1期
44-48
,共5页
高介电常数%覆铜板%天线
高介電常數%覆銅闆%天線
고개전상수%복동판%천선
High Dielectric Constant%Copper Clad Laminate%Antenna
近年来,由于无线通信的快速发展,使无线通信成为生活的必需.天线负责电路与空气中电磁能量的转换,为通信系统中不可或缺的基本设备.随着电子产品轻、薄、短、小的发展趋势,电子产品中元器件的设计也要朝此趋势发展.当前业界对于天线设计的重点在于小型化、结构简单化及多频或宽带.采用陶瓷作为基板制作小型化天线已经是众所周知,然而,陶瓷的不足之处是它易碎,并且有较高的制作成本,因为它必须使用烧结的方法来制备.高介电常数聚合物基覆铜板由于具有易加工、低温成型、低成本和优异的机械性能,已经引起了人们的广泛关注.本文对高介电常数聚合物基覆铜板的设计与制作进行了简要概述.
近年來,由于無線通信的快速髮展,使無線通信成為生活的必需.天線負責電路與空氣中電磁能量的轉換,為通信繫統中不可或缺的基本設備.隨著電子產品輕、薄、短、小的髮展趨勢,電子產品中元器件的設計也要朝此趨勢髮展.噹前業界對于天線設計的重點在于小型化、結構簡單化及多頻或寬帶.採用陶瓷作為基闆製作小型化天線已經是衆所週知,然而,陶瓷的不足之處是它易碎,併且有較高的製作成本,因為它必鬚使用燒結的方法來製備.高介電常數聚閤物基覆銅闆由于具有易加工、低溫成型、低成本和優異的機械性能,已經引起瞭人們的廣汎關註.本文對高介電常數聚閤物基覆銅闆的設計與製作進行瞭簡要概述.
근년래,유우무선통신적쾌속발전,사무선통신성위생활적필수.천선부책전로여공기중전자능량적전환,위통신계통중불가혹결적기본설비.수착전자산품경、박、단、소적발전추세,전자산품중원기건적설계야요조차추세발전.당전업계대우천선설계적중점재우소형화、결구간단화급다빈혹관대.채용도자작위기판제작소형화천선이경시음소주지,연이,도자적불족지처시타역쇄,병차유교고적제작성본,인위타필수사용소결적방법래제비.고개전상수취합물기복동판유우구유역가공、저온성형、저성본화우이적궤계성능,이경인기료인문적엄범관주.본문대고개전상수취합물기복동판적설계여제작진행료간요개술.
Due to the rapid development of wireless communication technology in recent years, wireless communication has become an essential part of modern life. The antenna is used for electromagnetic energy conversion between the circuit and the air, and is an indispensable piece of basic equipment for communication systems. With the trend of electronic products becoming light, thin, short, and small, the components for electronic products must also consider this trend in design. Current antenna design is focusing on miniaturization, structure simplification, and multi-band or broadband. An antenna employing ceramics as a substrate has also been known as the small-sized antenna. However, the ceramics is disadvantageous in that it can be easily broken and has a high manufacturing cost since it has to be fabricated using sintering. High dielectric constant polymer based copper clad laminate have drawn much attention due to their easy fabrication, low temperature process, low cost and excellent mechanical properties. The design and fabrication of high dielectric constant polymer based copper clad laminate were reviewed in this paper.