CAJ | 학술논문

主要阐述了随着PCB单板信号传送性能的提升对PCB线宽制作提出更高要求,即内外层图形需要更高精度.本文对内层图形成型过程中酸性蚀刻之蚀刻均匀性对线宽的影响进行定量研究,独创性将蚀刻均匀性同线宽公差进行关联分析并发现了单位量铜厚波动与线宽波动的线性关系及线性系数.以此为理论基础计算出不同铜厚制作时线宽公差的极限能力以及外层减成法来板铜厚极差对应的线宽公差极限,同时指明了提升线宽精度能力的方向-提升蚀刻均匀性.
주요천술료수착PCB단판신호전송성능적제승대PCB선관제작제출경고요구,즉내외층도형수요경고정도.본문대내층도형성형과정중산성식각지식각균균성대선관적영향진행정량연구,독창성장식각균균성동선관공차진행관련분석병발현료단위량동후파동여선관파동적선성관계급선성계수.이차위이론기출계산출불동동후제작시선관공차적겁한능력이급외층감성법래판동후겁차대응적선관공차겁한,동시지명료제승선관정도능력적방향-제승식각균균성.
Focuses primarily on the performance improvement of board sign transmission to demand higher requirements in PCB line width manufacturer, the inner and outer graphics need to be more accurate. we conducted the quantitative research about the affect of etch uniformity to linewide in acid etcher of graph manufacturing process. Originality by relevant research between the etch uniformity and line tolerance, we found the linear relationship of unit copper thickness fluctuation with linewide motion and the linear coefficient. As a basis for calculated the limited line tolerance in inner process and the corresponding limited line tolerance of different surface copper thickness in outlayers. At the same time,point out the direction of upgrade line ability-promote the etch uniformity.