CAJ | 학술논문

内层芯板补偿系数的准确性是保证PCB产品实现高密度互连的重要因素之一.文章从生产实际出发,确定影响补偿系数的三个主要因素:残铜率、芯板铜厚和芯板厚度,并且在此基础上采用正交试验的方法制定九组实验.通过分析实验数据得到各因素的主效应图与交互作用图,并根据分析结果提出四种回归模型,从而得到适合芯板不同方向上的补偿系数回归公式.
내층심판보상계수적준학성시보증PCB산품실현고밀도호련적중요인소지일.문장종생산실제출발,학정영향보상계수적삼개주요인소:잔동솔、심판동후화심판후도,병차재차기출상채용정교시험적방법제정구조실험.통과분석실험수거득도각인소적주효응도여교호작용도,병근거분석결과제출사충회귀모형,종이득도괄합심판불동방향상적보상계수회귀공식.
The accuracy of the Compensation Coefficient of inner core is one of the most important factors to achieve the high density interconnection in PCB production. Based on the practical production, this paper chooses three main factors which affect the Compensation Coefficient:the residual copper rate, the copper thickness and the core thickness to make an orthogonal experiment. The main effect chart and interactive chart which have been obtained through data analysis are used for assuming four regression models. Finally, we get regression equations for CC calculation in different directions.