印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
z1期
220-222
,共3页
孔缘破孔%定位%干膜流胶入孔%散热性
孔緣破孔%定位%榦膜流膠入孔%散熱性
공연파공%정위%간막류효입공%산열성
Rim Void%Same Location%Resist Flow Into Hole%Heat Dissipation
主要介绍孔缘破孔(在碱性蚀刻流程中发生的干膜流胶入孔致孔中开路)的影响因素.对定位孔缘破孔的形成机理进行分析及试验模拟,得出定位孔缘破孔的原因为:特殊结构特征板件在贴膜后板件板面局部温度较高,在没有散热完全情况下被收板放置在一起,导致定位区域干膜继续流胶入孔.通过提高贴膜后板件散热效果,最终杜绝定位孔缘破孔的产生.
主要介紹孔緣破孔(在堿性蝕刻流程中髮生的榦膜流膠入孔緻孔中開路)的影響因素.對定位孔緣破孔的形成機理進行分析及試驗模擬,得齣定位孔緣破孔的原因為:特殊結構特徵闆件在貼膜後闆件闆麵跼部溫度較高,在沒有散熱完全情況下被收闆放置在一起,導緻定位區域榦膜繼續流膠入孔.通過提高貼膜後闆件散熱效果,最終杜絕定位孔緣破孔的產生.
주요개소공연파공(재감성식각류정중발생적간막류효입공치공중개로)적영향인소.대정위공연파공적형성궤리진행분석급시험모의,득출정위공연파공적원인위:특수결구특정판건재첩막후판건판면국부온도교고,재몰유산열완전정황하피수판방치재일기,도치정위구역간막계속류효입공.통과제고첩막후판건산열효과,최종두절정위공연파공적산생.
This paper mainly introduces the factors of rim void, which is the resist flows into the hole and causes hole-opening in alkaline etching process. The rim void occurs in the same location, which was analyzed through theory and simulated by experiments, and the reason was archived. The temperature of local area with special structural characteristics boards is higher than others’, if the heat dissipation was poor after resist lamination, it will cause the resist flows farer into the hole in this location area. By improving the effect of heat dissipation after resist lamination, the location of the rim void will be eliminated finally.
