印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
z1期
234-239
,共6页
宁敏洁%何为%唐先忠%何雪梅%胡永栓%程世刚
寧敏潔%何為%唐先忠%何雪梅%鬍永栓%程世剛
저민길%하위%당선충%하설매%호영전%정세강
水平电镀%脉冲电镀%电镀填孔
水平電鍍%脈遲電鍍%電鍍填孔
수평전도%맥충전도%전도전공
Horizontal Plating%Pulse Electroplating%Plating Filling Holes
目前HDI印制电路板盲孔电镀填孔通常是采用水平电镀加垂直连续电镀填孔然后再减铜的方法,该方法工序复杂、耗时长且浪费电镀液.相反采用水平脉冲电镀填孔技术,可以简化工序,不需要减铜,节约了成本.本文主要采用水平电镀+水平填孔的方式实现一阶盲孔填孔,进行正交试验获取最佳的工艺参数,并通过金相显微切片观察和热应力测试来分析盲孔填孔效果.研究结果表明采用优化后参数进行水平电镀填孔,可以实现可靠的盲孔填孔,同时控制Dimple<10 mm,超出了IPC标准Dimple<15 mm的要求.
目前HDI印製電路闆盲孔電鍍填孔通常是採用水平電鍍加垂直連續電鍍填孔然後再減銅的方法,該方法工序複雜、耗時長且浪費電鍍液.相反採用水平脈遲電鍍填孔技術,可以簡化工序,不需要減銅,節約瞭成本.本文主要採用水平電鍍+水平填孔的方式實現一階盲孔填孔,進行正交試驗穫取最佳的工藝參數,併通過金相顯微切片觀察和熱應力測試來分析盲孔填孔效果.研究結果錶明採用優化後參數進行水平電鍍填孔,可以實現可靠的盲孔填孔,同時控製Dimple<10 mm,超齣瞭IPC標準Dimple<15 mm的要求.
목전HDI인제전로판맹공전도전공통상시채용수평전도가수직련속전도전공연후재감동적방법,해방법공서복잡、모시장차낭비전도액.상반채용수평맥충전도전공기술,가이간화공서,불수요감동,절약료성본.본문주요채용수평전도+수평전공적방식실현일계맹공전공,진행정교시험획취최가적공예삼수,병통과금상현미절편관찰화열응력측시래분석맹공전공효과.연구결과표명채용우화후삼수진행수평전도전공,가이실현가고적맹공전공,동시공제Dimple<10 mm,초출료IPC표준Dimple<15 mm적요구.
Currently the plating filling blind holes for HDI PCB were done by horizontal plating and vertical continuous plating with copper thickness reduction followed. The process is a complex, time-consuming and waste electroplating solution. The process can be simplified by horizontal pulse plating filling holes technology and do not need to decrease copper thickness and is cost saving. The first-order blind hole filling was realized by horizontal plating+horizontal filling way and the optimum technology parameters were obtained by orthogonal experiment. The hole filling effect was proved by metallographic slicing test and analysis of thermal stress test. Research results show that the blind hole filling with high reliability can be completed well by the optimum technology parameters of horizontal electroplating filling with Dimple<10 mm, which is better than the IPC standard requirements(Dimple<15 mm).