高端PCB镀铜阳极需用低磷微晶材料
고단PCB도동양겁수용저린미정재료
Why advanced PCB plating need to use microcrystalline copper anodes with low phosphor as its anode?
  • 万方数据
    印制电路信息 인제전로신식
    PRINTED CIRCUIT INFORMATION
    2012年 z1期 260-264 ,共5页

    陈世荣%杨琼%陈志佳%周湘陵%梁志立

    진세영%양경%진지가%주상릉%량지립

    印制电路板%镀铜阳极%低磷%微晶 印製電路闆%鍍銅暘極%低燐%微晶
    인제전로판%도동양겁%저린%미정
    PCB%Copper Anode%Low Phosphor%Microcrystalline
    叙述高端PCB制造工艺对镀铜阳极材料的要求;研究了低磷微晶磷铜阳极的电化学性能;介绍低磷微晶磷铜阳极材料的特点以及在制造高端PCB和电子芯片的应用前景.
    서술고단PCB제조공예대도동양겁재료적요구;연구료저린미정린동양겁적전화학성능;개소저린미정린동양겁재료적특점이급재제조고단PCB화전자심편적응용전경.
    The requirement of copper anode materials in advanced PCB manufacture process is described in this paper, the electrochemical performance of microcrystalline copper anodes with low phosphor is studied, main characters and the prospect future of microcrystalline copper anodes with low phosphor in advanced PCB and electron chip production are also described in detail.
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