电镀铜孪晶形成原因及对产品质量的影响
전도동련정형성원인급대산품질량적영향
Twin copper in the plating forming causes and effects on product quality
  • 万方数据
    印制电路信息 인제전로신식
    PRINTED CIRCUIT INFORMATION
    2012年 z1期 274-280 ,共7页

    陈良%刘镇权%王德槐%程静

    진량%류진권%왕덕괴%정정

    印制电路板%电镀铜孪晶%孔铜断裂 印製電路闆%電鍍銅孿晶%孔銅斷裂
    인제전로판%전도동련정%공동단렬
    PCB%Plating Copper Twin%Copper Break in the Hole Wall
    介绍PCB电镀铜过程中,铜孪晶产生的机理、图像及表现,并结合PCB在电镀铜实际生产过程中如何预防铜孪晶的产生,防止PCB板在客户端SMT高温焊接时或后期使用过程中,因铜孪晶问题导致PCB孔铜断裂发生失效的致命缺陷产生.
    개소PCB전도동과정중,동련정산생적궤리、도상급표현,병결합PCB재전도동실제생산과정중여하예방동련정적산생,방지PCB판재객호단SMT고온한접시혹후기사용과정중,인동련정문제도치PCB공동단렬발생실효적치명결함산생.
    This paper introduces the PCB plating copper twin presented in this paper, image and performance of twinning mechanism, combined with PCB copper electroplating practical and how to prevent dislocations in the production process to prevent PCB Board SMT welding at the client, copper PCB hole due to thermal stress problem fracture failure fatal defects occurred.
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