CAJ | 학술논문

目前印制电路板行业中电镀一直是HDI板产能的瓶颈工序,现考虑将通孔和盲孔都钻完后,同时电镀并结合DOE实验设计方法及特殊工艺方法,优化共镀参数.实验结果表明,当通孔孔径最小0.2 mm,最大3.5 mm和盲孔孔径最小0.075 mm,最大0.15 mm时,均能实现盲孔填铜及通孔共镀.测得盲孔填铜Dimple(微凹)≤15μm,通孔孔铜厚度在22μm左右,其热应力测试、冷热冲击测试及回流焊测试均符合IPC品质要求
목전인제전로판행업중전도일직시HDI판산능적병경공서,현고필장통공화맹공도찬완후,동시전도병결합DOE실험설계방법급특수공예방법,우화공도삼수.실험결과표명,당통공공경최소0.2 mm,최대3.5 mm화맹공공경최소0.075 mm,최대0.15 mm시,균능실현맹공전동급통공공도.측득맹공전동Dimple(미요)≤15μm,통공공동후도재22μm좌우,기열응력측시、랭열충격측시급회류한측시균부합IPC품질요구
Currently plating is HDI board capacity bottleneck of processes in the PCB industry. Now we use DOE experimental design method to optimizing the plating parameters and combine with special process to achieve simultaneous blind hole filled copper and through-hole metallization. The result shows that the effect of simultaneous plating is good regardless of the through-hole diameter minimum is 0.2 mm , maximum is 3.5mm and blind hole diameter minimum is 0.075 mm, maximum is 0.15 mm. Blind filled copper dimple≤15μm and the through-hole copper thickness is about 22μm, its thermal stress test, hot and cold shock, reflow test are all meet the IPC quality requirements.