印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
z1期
303-307
,共5页
刚挠结合%层压%改善
剛撓結閤%層壓%改善
강뇨결합%층압%개선
Rigid-Flex Board%Laminate%Improve
近年来随着手机、通讯和消费类电子产品的发展,刚扰结合板需求量急剧增加.刚挠结合板体积小、重量轻,能实现代替接插件以及立体安装的特点,在未来的数码通讯以及计算机领域占主导力量,所以对刚挠结合板行业发展前景是一大优势,但刚挠结合板随着高密度、薄型化发展的同时,制作难度随之加大,其中刚挠结合压合后褶皱就是难点管控之一.本文主要通过对刚挠结合板压合后褶皱原理分析后实施方案进行改善.
近年來隨著手機、通訊和消費類電子產品的髮展,剛擾結閤闆需求量急劇增加.剛撓結閤闆體積小、重量輕,能實現代替接插件以及立體安裝的特點,在未來的數碼通訊以及計算機領域佔主導力量,所以對剛撓結閤闆行業髮展前景是一大優勢,但剛撓結閤闆隨著高密度、薄型化髮展的同時,製作難度隨之加大,其中剛撓結閤壓閤後褶皺就是難點管控之一.本文主要通過對剛撓結閤闆壓閤後褶皺原理分析後實施方案進行改善.
근년래수착수궤、통신화소비류전자산품적발전,강우결합판수구량급극증가.강뇨결합판체적소、중량경,능실현대체접삽건이급입체안장적특점,재미래적수마통신이급계산궤영역점주도역량,소이대강뇨결합판행업발전전경시일대우세,단강뇨결합판수착고밀도、박형화발전적동시,제작난도수지가대,기중강뇨결합압합후습추취시난점관공지일.본문주요통과대강뇨결합판압합후습추원리분석후실시방안진행개선.
In recent years, along with the development of mobile phone, communications, consumer electronics products, the demand of rigid-flexible PCB is increases quickly. Because of the rigid-flexible PCB is more smaller and lighter, which can replace assembly and the characteristics of the three-dimensional installation, it will be the leading force in the trade of digital communication and computer. The development of rigid-flexible PCB is a big superiority. However with the high density and the thin-tendency development of the rigid–flex PCB, the manufacturing comes to be more and more difficult. The copper foil wrinkle after lamination is one of most difficulty control point. This paper gives a development program to correct the problem of copper foil wrinkle after lamination after analysis.