CAJ | 학술논문

使用半固化片(PP)开窗法制作Semi-flex印制电路板时,半固化片开窗的尺寸及品质直接影响压合时树脂向Semi-flex印制板挠性区域的流动情况,进而影响其挠曲性能.本文使用开窗法制作挠性层为L5/L6层的10层Semi-flex印制板,研究了铣刀转速、叠合张数等加工参数对半固化片开窗品质的影响,以及半固化片开窗放大尺寸与压合时刚挠结合处PP溢胶长度的关系.为了验证产品其可靠性,对其进行了漂锡测试、回流焊测试和冷热冲击测试.
사용반고화편(PP)개창법제작Semi-flex인제전로판시,반고화편개창적척촌급품질직접영향압합시수지향Semi-flex인제판뇨성구역적류동정황,진이영향기뇨곡성능.본문사용개창법제작뇨성층위L5/L6층적10층Semi-flex인제판,연구료선도전속、첩합장수등가공삼수대반고화편개창품질적영향,이급반고화편개창방대척촌여압합시강뇨결합처PP일효장도적관계.위료험증산품기가고성,대기진행료표석측시、회류한측시화랭열충격측시.
When manufacturing semi-flex printed circuit board by opening windows in prepreg, the size and quality of open windows directly affect the movement of resin flowing into the flexible area of semi-flex printed board, which will influence its flexural property. In this paper, a 10 layers semi-flex printed board was manufactured by opening windows in prepreg, of which the flexible layers were located in layer 5 and layer 6. The influence of process parameters such as milling speed and prepreg piled-up number on the quality of open windows in prepreg was studied. The relationship between the amplification size of open window and the length of resin flowing into flexible area in lamination process was also studied. To evaluate product’s reliability, Solder Float Test, IR Reflow Test and Thermal Shock Test were demonstrated.