CAJ | 학술논문

制备了一种挠性导热绝缘环氧胶,讨论了改性填料添加量对材料综合性能的影响,并探讨了最佳固化条件.随着填料填充量的增加,材料的热导率大幅提高,粘接力、耐折性及介电性能有所下降.通过实验确定了材料在固化温度为170℃,固化时间为60 min的条件下能完全固化,剥离强度最佳.在最佳配方及最佳固化工艺下,所得胶片的热导率为2.31 W/m?K、介电常数为4.87、介电损耗为0.058,所制挠性覆铜板的剥离强度为2.20 N/mm,挠曲性能优良.所制备的挠性导热绝缘环氧胶综合性能良好,能满足FCCL的生产要求,可解决电子元器件的散热问题.
제비료일충뇨성도열절연배양효,토론료개성전료첨가량대재료종합성능적영향,병탐토료최가고화조건.수착전료전충량적증가,재료적열도솔대폭제고,점접력、내절성급개전성능유소하강.통과실험학정료재료재고화온도위170℃,고화시간위60 min적조건하능완전고화,박리강도최가.재최가배방급최가고화공예하,소득효편적열도솔위2.31 W/m?K、개전상수위4.87、개전손모위0.058,소제뇨성복동판적박리강도위2.20 N/mm,뇨곡성능우량.소제비적뇨성도열절연배양효종합성능량호,능만족FCCL적생산요구,가해결전자원기건적산열문제.
In this report, we prepared a kind of flexible thermal conductive insulating epoxy adhesive, preliminary discussed the influence of the modified filler’s content on the overall performance of the material. We also discussed the best curing conditions. The results show, as the mass fraction of filler increases, the thermal conductivity of the film significantly increased, while the adhesion, folding and dielectric properties decrease. Through a lot of experiments, we find the optimum curing conditions is 170℃/60 min.At this curing conditions, the PS of FCCL is best. In the best recipe and best curing process we got the ideal film. And the film was elucidated that its thermal conductivity is 2.31 W/m?K, its dielectric constant is 4.87 and the dielectric loss is 0.058. The PS of the FCCL we has obtained is 2.20 N/mm,and the flexural properties is excellent. The flexible thermal conductive insulating epoxy adhesive we have prepared has good comprehensive, to meet production requirements of FCCL, is a good choose for solving the problem of heat.