印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
z1期
357-362
,共6页
厚铜板%成品板尺寸稳定性%变形机理
厚銅闆%成品闆呎吋穩定性%變形機理
후동판%성품판척촌은정성%변형궤리
Heavy Copper Boards%Finished Boards Dimension Stability%Deformation Principle
从理论上分析了PCB板制造过程中不同铜厚产生不同残余应力的机理,总结了残余应力是不同铜厚成品板回流缩短的尺寸稳定性的原因,分析了不同铜厚板全流程中可能产生变形的各个加工工序的加工变形机理,并用实验验证了不同铜厚板变形机理,本理论能指导厚铜PCB制造和电子组装,能提高厚铜PCB制造技术.
從理論上分析瞭PCB闆製造過程中不同銅厚產生不同殘餘應力的機理,總結瞭殘餘應力是不同銅厚成品闆迴流縮短的呎吋穩定性的原因,分析瞭不同銅厚闆全流程中可能產生變形的各箇加工工序的加工變形機理,併用實驗驗證瞭不同銅厚闆變形機理,本理論能指導厚銅PCB製造和電子組裝,能提高厚銅PCB製造技術.
종이론상분석료PCB판제조과정중불동동후산생불동잔여응력적궤리,총결료잔여응력시불동동후성품판회류축단적척촌은정성적원인,분석료불동동후판전류정중가능산생변형적각개가공공서적가공변형궤리,병용실험험증료불동동후판변형궤리,본이론능지도후동PCB제조화전자조장,능제고후동PCB제조기술.
This thesis analyzed the theoretical principle of different remain stress occurrence caused by different copper thickness during the PCB manufacturing process. Remain force is the cause of the finished boards with different copper thickness becoming short in dimensions stability after re-flow, this theme was summarize in the essay. At the same time, production processes will lead remain stress and deformation of the boards, the principle of each production process was also analyzed and validated by experiment. This thesis serves as a theoretical introduction for the heavy copper PCB manufacturing and assembly, which can improve the heavy copper PCB manufacturing technology.
