CAJ | 학술논문

近年来,受无铅化RoSH指令和WEEE的影响,印制线路板的表面处理正由传统的热风整平工艺逐步转向其它无铅化表面处理.OSP(organic solderability preservatives)因其特有的优点,在诸多无铅化表面处理中占据了一定的市场份额.对于OSP的可焊性,行业内多数只对回流次数与润湿性能变化做表征研究,鲜见有关于不同热时效下膜厚与润湿性能关系及其三者内在关系的报道.此外,对于表面膜厚与孔内膜厚的差异及其变化对焊接性能的影响也鲜见报道.本文将结合生产实际,阐述不同热时效下膜厚与润湿性能的关系,分析孔内膜厚与爬锡性能的关系,为OSP的无铅化推广提供理论依据.
근년래,수무연화RoSH지령화WEEE적영향,인제선로판적표면처리정유전통적열풍정평공예축보전향기타무연화표면처리.OSP(organic solderability preservatives)인기특유적우점,재제다무연화표면처리중점거료일정적시장빈액.대우OSP적가한성,행업내다수지대회류차수여윤습성능변화주표정연구,선견유관우불동열시효하막후여윤습성능관계급기삼자내재관계적보도.차외,대우표면막후여공내막후적차이급기변화대한접성능적영향야선견보도.본문장결합생산실제,천술불동열시효하막후여윤습성능적관계,분석공내막후여파석성능적관계,위OSP적무연화추엄제공이론의거.
By the effect of RoSH instruction and WEEE, the surface treatment process had been changed from HASL to the other lead free surface treatment process. For its advantage, OSP (organic solderability preservatives) maintained some market share. Research on the solderability, there were many reports about relationship between cycles of reflow and wettability, few scholars concerned about the relationship among different heat effects, film thickness and wettability. In addition, there were seldom reports about the difference between surface film thickness and inner hole film thickness. In this paper, relationship of different heat effect, film thickness and the solderability had been discussed, and the influence of solderability on surface and inner hole film thickness also had been analyzed. The research could provide some theory support for the revolution of lead-free.