CAJ | 학술논문

随着线路板不断向高密度、小型化方向发展,客户设计的密集散热孔孔壁间距也越来越小,在热应力测试后密集孔出现分层的风险也相应加大.本文测试并分析了不同板材、不同孔壁间距、不同孔径、不同孔的设计类型对密集孔分层的影响,并制定了相应的设计规范,为PCB设计时提供了有价值的参考.
수착선로판불단향고밀도、소형화방향발전,객호설계적밀집산열공공벽간거야월래월소,재열응력측시후밀집공출현분층적풍험야상응가대.본문측시병분석료불동판재、불동공벽간거、불동공경、불동공적설계류형대밀집공분층적영향,병제정료상응적설계규범,위PCB설계시제공료유개치적삼고.
As the circuit board developing to high density and miniaturization, customers design dense holes whose pitch becomes smaller and smaller, and the delamination risk on dense holes is increasing after the thermal stress test. In the paper, we have tested and analyzed the effect on delamination of different materials, different space of the hole wall to wall, different hole diameter and different hole types, and constituted relevant design criterion to provide a valuable reference for PCB design.