CAJ | 학술논문

应用大功率器件组装的PCB是电子产品电气性能高频化与高速化的实现基础,但是大功率器的局部热集中会降低PCB传输信号的可靠性.以FR4基板、PPE基板与HC基板为研究对象,研究了其温变导热系数、温变热分解性能与温变CTE性能,通过HC基板制作盲孔考察了盲孔的温变耐热性.结果表明了HC基板的温变热性能优于FR4基板与PPE基板,其导热系数随着温升高而稍微变大,100℃时导热系数为0.797 W/m·K,基板的初始热分解温度达到350℃,25℃~300℃热膨胀系数为72.7×10-6/℃,且通过HC基板制作的盲孔具有良好温变耐热性,HC基板适用于高频印制电路板的制作.
응용대공솔기건조장적PCB시전자산품전기성능고빈화여고속화적실현기출,단시대공솔기적국부열집중회강저PCB전수신호적가고성.이FR4기판、PPE기판여HC기판위연구대상,연구료기온변도열계수、온변열분해성능여온변CTE성능,통과HC기판제작맹공고찰료맹공적온변내열성.결과표명료HC기판적온변열성능우우FR4기판여PPE기판,기도열계수수착온승고이초미변대,100℃시도열계수위0.797 W/m·K,기판적초시열분해온도체도350℃,25℃~300℃열팽창계수위72.7×10-6/℃,차통과HC기판제작적맹공구유량호온변내열성,HC기판괄용우고빈인제전로판적제작.
Electronic products with high speed and high frequency depend on the printed circuit boards (PCB) packaging with high-power devices, but the reliability of signal transmission of PCB can be reduced by partial heat concentration from high-power devices. The PCB laminates of hydrocarbon (HC), halogen free epoxy resin (FR4) and polyphenyl ether (PPE) were respectively studied on thermal conductivities, thermolysis resistance and coefficient of thermal expansion (CTE) in dynamic temperature. The blind hole in HC laminate was investigated on thermal endurance. The results showed that the thermal properties of HC laminate were better than that of FR4 laminate and PPE laminate. Thermal conductivity of HC laminate was 0.797 W/m?K in 100℃, The initial temperature of thermolysis of HC laminate reached to 350℃and CTE of HC laminate was 72.7×10-6/℃in the temperature ranging from 25℃to 300℃. The blind hole in HC laminate had good reliability against high temperature. HC laminate showed good agreement with the use of manufacturing high frequency PCB.