CAJ | 학술논문

采用高导热填料球形氧化铝填充环氧胶粘剂,并添加了适量离子捕捉剂有效地控制有害离子的离子迁移,利用该胶粘剂粘接铝箔和铜箔制备成挠性铝基覆铜板.文章中探讨了环氧胶粘剂的热固化温度和时间、球形氧化铝含量对胶膜热导率的影响,通过显微镜测试了导热填料在胶粘剂中的分散均匀性,最后确定最优配方制备出一种综合性能优异的挠性铝基覆铜板.
채용고도열전료구형양화려전충배양효점제,병첨가료괄량리자포착제유효지공제유해리자적리자천이,이용해효점제점접려박화동박제비성뇨성려기복동판.문장중탐토료배양효점제적열고화온도화시간、구형양화려함량대효막열도솔적영향,통과현미경측시료도열전료재효점제중적분산균균성,최후학정최우배방제비출일충종합성능우이적뇨성려기복동판.
Using high thermal conductivity filler-spherical alumina filled epoxy adhesive, adding appropriate amount of ion trapping agent to effectively control the migration of harmful ion, with the adhesive bonding of aluminum foil and copper foil, the flexible Al-based copper clad laminate was prepared. The paper discussed the curing temperature and time of epoxy adhesive and the conductivity effects of spherical alumina content on adhesive film. Through the microscope the dispersion uniformity of thermal, the conductivity filler in adhesive was tested. Finally a flexible Al-based copper clad laminate with excellent comprehensive performance was prepared by determined the optimal formula.