电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
5期
31-33
,共3页
图形电路%化学镀金%细间距%表面
圖形電路%化學鍍金%細間距%錶麵
도형전로%화학도금%세간거%표면
patterned circuit%electroless gold plating%fine-pitch%surface
采用市售无氰化学金工艺在线宽/间距(50μm/50μm)精细图形电路表面化学镀金.镀层表面均匀一致,厚度可达2μm以上,无镀金层溢出现象.新的化学镀金工艺作为微带板可焊性表面处理技术之一,兼具可选择区域镀、可接触导通、良好的键合性能,能兼容各种助焊剂,对于细间距图形电路表面处理具有十分重要的意义.
採用市售無氰化學金工藝在線寬/間距(50μm/50μm)精細圖形電路錶麵化學鍍金.鍍層錶麵均勻一緻,厚度可達2μm以上,無鍍金層溢齣現象.新的化學鍍金工藝作為微帶闆可銲性錶麵處理技術之一,兼具可選擇區域鍍、可接觸導通、良好的鍵閤性能,能兼容各種助銲劑,對于細間距圖形電路錶麵處理具有十分重要的意義.
채용시수무청화학금공예재선관/간거(50μm/50μm)정세도형전로표면화학도금.도층표면균균일치,후도가체2μm이상,무도금층일출현상.신적화학도금공예작위미대판가한성표면처리기술지일,겸구가선택구역도、가접촉도통、량호적건합성능,능겸용각충조한제,대우세간거도형전로표면처리구유십분중요적의의.
Commercial cyanide-free electroless Gold Plating technology used to deposit gold film on patterned circuits with fine-pitch(50 μm/50 μm). Investigated results indicated the thickness of gold film up to 2 μm, the film surface is smooth, and no gold coating spill over. New electroless gold plating progress as one of the weld surface treatment technology, can be used to selective area plating, has contact conductive, good bonding performance, and can compatible with various solder. This technology has the significance for the fine-pitch patterned circuits.
