CAJ | 학술논문

针对一个具体的电子设备,分析机箱内部的传热类型,采用专业的热分析软件Icepak对其进行稳态热仿真,求解封闭结构达到热平衡时的温度场,指出内部器件温度超过允许温度上限的原因,提出两种改进结构形式的措施,重新计算在前后面板开通风孔散热的机箱内部温度场.计算结果显示,内部器件最高温度在允许工作范围内,从而有效降低了电子设备机箱内温度,保证设备稳定可靠工作,提高结构设计与改进的效率.
침대일개구체적전자설비,분석궤상내부적전열류형,채용전업적열분석연건Icepak대기진행은태열방진,구해봉폐결구체도열평형시적온도장,지출내부기건온도초과윤허온도상한적원인,제출량충개진결구형식적조시,중신계산재전후면판개통풍공산열적궤상내부온도장.계산결과현시,내부기건최고온도재윤허공작범위내,종이유효강저료전자설비궤상내온도,보증설비은정가고공작,제고결구설계여개진적효솔.
Types of thermal transmission in chassis for one special electronic equipment are analyzed. Steady thermal simulation is performed by professional thermal analysis software Icepak. To calculate the temper?ature field when the blocked structure getting heat equilibrium, reasons that the temperature of inner devices is above upper limited temperature are explained. Two methods for improving structures are proposed. Temperature field in chassis with vent holes on front and back panels for heat exhaust is calculated again. Calculation results show that the highest temperature in inner devices is in permitted operation temperature range. So the tempera?ture in chassis is reduced effectively to ensure the equipments in stable and reliable operation states. And struc?ture design and improvement effectiveness are enhanced.