电子器件
電子器件
전자기건
JOURNAL OF ELECTRON DEVICES
2014年
6期
1261-1266
,共6页
电源技术%反激有源钳位%同步整流%功率密度
電源技術%反激有源鉗位%同步整流%功率密度
전원기술%반격유원겸위%동보정류%공솔밀도
power supply technology%flyback active clamp techniques%synchronous rectifying%power density
有源钳位技术通常只在正激DC/DC功率电源拓扑结构中。现介绍有源钳位和同步整流技术在反激拓扑结构中的应用及研究。通过有源钳位和同步整流应用到反激式拓扑中的原理设计技术,以及厚膜和模块立体混装技术,以达到电源高效率和高功率密度的目的。通过5 V/20 W电源样品设计和组装以及模拟试验,电源样品功率密度达50.8 W/inch3,效率为89.2%,纹波为43 mV。试验样品证明反激式有源钳位和同步整流技术是提高中小功率隔离电源功率密度的最有效技术途径。
有源鉗位技術通常隻在正激DC/DC功率電源拓撲結構中。現介紹有源鉗位和同步整流技術在反激拓撲結構中的應用及研究。通過有源鉗位和同步整流應用到反激式拓撲中的原理設計技術,以及厚膜和模塊立體混裝技術,以達到電源高效率和高功率密度的目的。通過5 V/20 W電源樣品設計和組裝以及模擬試驗,電源樣品功率密度達50.8 W/inch3,效率為89.2%,紋波為43 mV。試驗樣品證明反激式有源鉗位和同步整流技術是提高中小功率隔離電源功率密度的最有效技術途徑。
유원겸위기술통상지재정격DC/DC공솔전원탁복결구중。현개소유원겸위화동보정류기술재반격탁복결구중적응용급연구。통과유원겸위화동보정류응용도반격식탁복중적원리설계기술,이급후막화모괴입체혼장기술,이체도전원고효솔화고공솔밀도적목적。통과5 V/20 W전원양품설계화조장이급모의시험,전원양품공솔밀도체50.8 W/inch3,효솔위89.2%,문파위43 mV。시험양품증명반격식유원겸위화동보정류기술시제고중소공솔격리전원공솔밀도적최유효기술도경。
The active clamp techniques is usually used in the forwad topology of DC/DC power supply. Study of active clamp and synchronous rectifying techniques in single out of flyback topology is introduced. By means of principle,de-signing of active clamp and synchronous rectifying techniques apply to single out of flyback topology, mixed assembling techniques of thick flim and modules to achieve the purpose of high efficiency and high power density. By the 5 V/20 W power sample machining and simulation testing,power density of the power sample is 50.8 W/inch3, power efficiency of the power sample is 89.2%,nose ripple of the power sample is 43 mV. The power sample proves that this techniques is efficient apptoaches to increase the power density of isolation DC/DC power supply.