电子器件
電子器件
전자기건
JOURNAL OF ELECTRON DEVICES
2014年
6期
1136-1140
,共5页
集成气体传感器阵列%微热板%加热驱动电路%模拟集成电路设计
集成氣體傳感器陣列%微熱闆%加熱驅動電路%模擬集成電路設計
집성기체전감기진렬%미열판%가열구동전로%모의집성전로설계
integrated gas sensor array%MHP(micro-hotplate)%heater driver circuit%analog IC design
基于集成微热板气体传感器阵列的应用需求，采用CSMC的0.5μm标准CMOS工艺设计了片上加热驱动电路，可根据外部控制信号实现阵列中各微热板加热温度的独立调节。利用Hspice完成了电路仿真，并进行了代工流片。实验测试结果表明该加热驱动电路满足设计要求，各路加热通道产生的驱动电流相对误差小于2%，并且切换电流时无明显过冲现象。
基于集成微熱闆氣體傳感器陣列的應用需求，採用CSMC的0.5μm標準CMOS工藝設計瞭片上加熱驅動電路，可根據外部控製信號實現陣列中各微熱闆加熱溫度的獨立調節。利用Hspice完成瞭電路倣真，併進行瞭代工流片。實驗測試結果錶明該加熱驅動電路滿足設計要求，各路加熱通道產生的驅動電流相對誤差小于2%，併且切換電流時無明顯過遲現象。
기우집성미열판기체전감기진렬적응용수구，채용CSMC적0.5μm표준CMOS공예설계료편상가열구동전로，가근거외부공제신호실현진렬중각미열판가열온도적독립조절。이용Hspice완성료전로방진，병진행료대공류편。실험측시결과표명해가열구동전로만족설계요구，각로가열통도산생적구동전류상대오차소우2%，병차절환전류시무명현과충현상。
Based on the application requirements of the MHP ( Micro-hotplate) gas sensor array,the heating driver circuit was designed by using the CSMC 0.5 microns standard CMOS process. On the basis of external control sig-nal,independent temperature regulation of the MHP is realized. The simulation of driver circuit by using Hspice was accomplished,and the tapeout was carried out. The test results showed that the proposed heating driver circuit met the design requirement. The relative error of driver current was less than 2% in each heating channel,and no obvi-ous overshoot phenomenon occurred when MOS switch was on and off.
