耐火材料
耐火材料
내화재료
REFRACTORIES
2014年
6期
409-413
,共5页
王青峰%叶国田%李坤鹏%宋秀娟%杨晓
王青峰%葉國田%李坤鵬%宋秀娟%楊曉
왕청봉%협국전%리곤붕%송수연%양효
SiO2 微粉%铝酸钙水泥%刚玉质浇注料%化学键
SiO2 微粉%鋁痠鈣水泥%剛玉質澆註料%化學鍵
SiO2 미분%려산개수니%강옥질요주료%화학건
microsilica%calcium aluminate cement%corundum castable%chemical bond
以电熔棕刚玉(8~5、5~3、3~1 mm)和电熔白刚玉(≤1、≤0.045 mm)为主要原料,添加α-Al2 O3微粉和SiO2微粉制备铝酸钙水泥结合刚玉质浇注料,研究了经110、800和1000℃热处理后含5%(w)SiO2微粉和不含SiO2微粉浇注料基质中化学键变化与浇注料强度的关系。采用XPS和FTIR研究SiO2微粉与水泥水化产物经110℃烘干和800℃热处理后的化学键变化。结果表明,经110和800℃热处理后,SiO2微粉和水泥水化物之间形成了Si—O—Al结合键。因此,在110~800℃,含SiO2微粉的铝酸钙水泥结合浇注料的强度较高的原因是SiO2微粉与水泥水化物之间形成了Si—O—Al化学键。
以電鎔棕剛玉(8~5、5~3、3~1 mm)和電鎔白剛玉(≤1、≤0.045 mm)為主要原料,添加α-Al2 O3微粉和SiO2微粉製備鋁痠鈣水泥結閤剛玉質澆註料,研究瞭經110、800和1000℃熱處理後含5%(w)SiO2微粉和不含SiO2微粉澆註料基質中化學鍵變化與澆註料彊度的關繫。採用XPS和FTIR研究SiO2微粉與水泥水化產物經110℃烘榦和800℃熱處理後的化學鍵變化。結果錶明,經110和800℃熱處理後,SiO2微粉和水泥水化物之間形成瞭Si—O—Al結閤鍵。因此,在110~800℃,含SiO2微粉的鋁痠鈣水泥結閤澆註料的彊度較高的原因是SiO2微粉與水泥水化物之間形成瞭Si—O—Al化學鍵。
이전용종강옥(8~5、5~3、3~1 mm)화전용백강옥(≤1、≤0.045 mm)위주요원료,첨가α-Al2 O3미분화SiO2미분제비려산개수니결합강옥질요주료,연구료경110、800화1000℃열처리후함5%(w)SiO2미분화불함SiO2미분요주료기질중화학건변화여요주료강도적관계。채용XPS화FTIR연구SiO2미분여수니수화산물경110℃홍간화800℃열처리후적화학건변화。결과표명,경110화800℃열처리후,SiO2미분화수니수화물지간형성료Si—O—Al결합건。인차,재110~800℃,함SiO2미분적려산개수니결합요주료적강도교고적원인시SiO2미분여수니수화물지간형성료Si—O—Al화학건。
Cal ci um al umi nate cement bonded corundum castabl e speci mens were prepared usi ng brown fused corundum (8-5,5 -3,3-1 mm),white fused corundum (1 -0,≤0.045 mm),micro-sized α-Al2O3 and microsilica as starting materials.This work was focused on investigating the relationship between the bond change in the castable matrix and the strength of the castable with 5 mass% microsilica or without microsilica after heat treatment at 110,800,and 1 000 ℃,respectively.Chemical bond changes between the microsilica and hydrates of calcium aluminate cement after drying at 110 ℃or firing at 800 ℃were investi-gated by XPS and FTI R.The results show that Si—O—Al bonds form between the microsilica and hydrates of calcium aluminate cement after drying at 110 ℃ or firing at 800 ℃.Therefore,the increased strength of castable specimens is attributed to the formation of Si—O—Al bonds from 110 ℃ to 800 ℃.