激光与红外
激光與紅外
격광여홍외
LASER & INFRARED
2014年
12期
1312-1318
,共7页
卞宏友%雷洋%王婷%杨光%钦兰云%王维%韩双隆
卞宏友%雷洋%王婷%楊光%欽蘭雲%王維%韓雙隆
변굉우%뢰양%왕정%양광%흠란운%왕유%한쌍륭
金属激光沉积成形%基板分区预热%温度场%数值模拟
金屬激光沉積成形%基闆分區預熱%溫度場%數值模擬
금속격광침적성형%기판분구예열%온도장%수치모의
metal laser deposition shaping%substrate partition preheating%temperature field%numerical simulation
为减小工件变形和防止工件开裂,提出了采用分区预热装置对基板成形区和近成形区进行分区预热,利用温差拉伸效应主动控制降低应力的新思路。利用ANSYS有限元中的“单元生死”技术,建立单道多层激光沉积成形过程三维温度场的数值模拟模型,深入研究了在基板成形区和近成形区施加不同预热温度以及两区形成不同预热温差(预热温差分别为100℃、200℃、300℃)状态下对成形过程温度场和温度梯度的影响规律,并指出相对于基板整体预热方式,基板分区预热方式下的成形过程温度梯度更趋于稳定,有利于降低热应力;上述分析结果可为分区预热装置设计、预热温度的选择优化提供指导依据。
為減小工件變形和防止工件開裂,提齣瞭採用分區預熱裝置對基闆成形區和近成形區進行分區預熱,利用溫差拉伸效應主動控製降低應力的新思路。利用ANSYS有限元中的“單元生死”技術,建立單道多層激光沉積成形過程三維溫度場的數值模擬模型,深入研究瞭在基闆成形區和近成形區施加不同預熱溫度以及兩區形成不同預熱溫差(預熱溫差分彆為100℃、200℃、300℃)狀態下對成形過程溫度場和溫度梯度的影響規律,併指齣相對于基闆整體預熱方式,基闆分區預熱方式下的成形過程溫度梯度更趨于穩定,有利于降低熱應力;上述分析結果可為分區預熱裝置設計、預熱溫度的選擇優化提供指導依據。
위감소공건변형화방지공건개렬,제출료채용분구예열장치대기판성형구화근성형구진행분구예열,이용온차랍신효응주동공제강저응력적신사로。이용ANSYS유한원중적“단원생사”기술,건립단도다층격광침적성형과정삼유온도장적수치모의모형,심입연구료재기판성형구화근성형구시가불동예열온도이급량구형성불동예열온차(예열온차분별위100℃、200℃、300℃)상태하대성형과정온도장화온도제도적영향규률,병지출상대우기판정체예열방식,기판분구예열방식하적성형과정온도제도경추우은정,유리우강저열응력;상술분석결과가위분구예열장치설계、예열온도적선택우화제공지도의거。
To reduce work-piece deformation and prevent cracking,a new idea of substrate partition preheating is pro-posed.Substrate forming area and near forming area were respectively preheated through partition preheating device, and the stress of work-piece was actively controlled and reduced base on thermal stretching effect.A numerical simu-lation model of 3D temperature field for single-pass and multi-layer laser deposition shaping process was established through the birth-and-death elements of ANSYS.Change rules of forming process temperature field and temperature gradient were studied,when substrate forming area and near forming area were respectively applied different preheating temperature and formed different preheating temperature difference between two areas (preheating temperature differ-ence are 100 ℃,200 ℃,300 ℃).Compared with the substrate whole preheating mode,the process temperature gra-dient is more stable under substrate partition preheating mode,and it is helpful to reduce the thermal stress.Analysis results will provide guidance for the design of partition preheating device and optimal selection of the preheating tem-perature.