金刚石与磨料磨具工程
金剛石與磨料磨具工程
금강석여마료마구공정
DIAMOND & ABRASIVES ENGINNERING
2014年
6期
1-6
,共6页
6 H-SiC 单晶片%研磨%表面质量%划痕%材料去除
6 H-SiC 單晶片%研磨%錶麵質量%劃痕%材料去除
6 H-SiC 단정편%연마%표면질량%화흔%재료거제
6 H-SiC monocrystalline wafer%lapping%surface quality%scratch%material removal
采用硬基研磨盘对6H-SiC 单晶片进行单面研磨,分析了晶片加工表面形貌和划痕特征。实验结果表明：采用铸铁盘相对于采用硬度较低的铜盘和铝盘研磨后的晶片表面较均匀。采用铸铁盘研磨时金刚石磨料和碳化硼磨料较适合单晶 SiC 的研磨加工。用 M0.5/1.5金刚石磨粒研磨后,SiC 单晶片表面的断裂凹坑密集而细小,但容易出现划痕和研磨不均匀,而且分散性差,团聚后容易使晶片表面产生大的划痕；实验条件下铸铁研磨盘比较适合 M3/6以粗的金刚石磨料研磨。研磨过程中,磨粒的行为对表面质量有重要影响。切入较深的磨粒使工件产生微裂纹,从而导致工件表面产生滚压破碎凹坑、划擦痕迹和脆性断裂划痕；切入较浅的磨粒使工件产生微量塑性变形,而使晶片表面产生微量塑性去除划痕。
採用硬基研磨盤對6H-SiC 單晶片進行單麵研磨,分析瞭晶片加工錶麵形貌和劃痕特徵。實驗結果錶明：採用鑄鐵盤相對于採用硬度較低的銅盤和鋁盤研磨後的晶片錶麵較均勻。採用鑄鐵盤研磨時金剛石磨料和碳化硼磨料較適閤單晶 SiC 的研磨加工。用 M0.5/1.5金剛石磨粒研磨後,SiC 單晶片錶麵的斷裂凹坑密集而細小,但容易齣現劃痕和研磨不均勻,而且分散性差,糰聚後容易使晶片錶麵產生大的劃痕；實驗條件下鑄鐵研磨盤比較適閤 M3/6以粗的金剛石磨料研磨。研磨過程中,磨粒的行為對錶麵質量有重要影響。切入較深的磨粒使工件產生微裂紋,從而導緻工件錶麵產生滾壓破碎凹坑、劃抆痕跡和脆性斷裂劃痕；切入較淺的磨粒使工件產生微量塑性變形,而使晶片錶麵產生微量塑性去除劃痕。
채용경기연마반대6H-SiC 단정편진행단면연마,분석료정편가공표면형모화화흔특정。실험결과표명：채용주철반상대우채용경도교저적동반화려반연마후적정편표면교균균。채용주철반연마시금강석마료화탄화붕마료교괄합단정 SiC 적연마가공。용 M0.5/1.5금강석마립연마후,SiC 단정편표면적단렬요갱밀집이세소,단용역출현화흔화연마불균균,이차분산성차,단취후용역사정편표면산생대적화흔；실험조건하주철연마반비교괄합 M3/6이조적금강석마료연마。연마과정중,마립적행위대표면질량유중요영향。절입교심적마립사공건산생미렬문,종이도치공건표면산생곤압파쇄요갱、화찰흔적화취성단렬화흔；절입교천적마립사공건산생미량소성변형,이사정편표면산생미량소성거제화흔。
Single-sided lapping experiment was carried out on 6H-SiC monocrystalline wafer using hard-base lapping plate.Wafer surface topography and scratch performance after lapping were analyzed.The surface lapped by cast iron plate was more uniform than those lapped by copper plate and aluminium plate.Diamond abrasive and boron carbide abrasive were more suitable for monocrystalline SiC wafer lapped with cast iron plate.The surface had many dense and tiny pits produced by brittle fracture when the SiC wafer were lapped by M0.5/1.5 diamond abrasives.However,small size abrasive was very hard to disperse and glomerate abrasive was easy to generate scratch and uneven lapping,so that the particle size greater than M3/6 were more suitable for cast iron plate to machine SiC wafer.Deep cut abrasives were easy to produce micro cracks,which would cause brittle fracture pits rolled by abrasives predominates and brittle removal scratchs.Shallow cut abrasives led some microscale plastic removal scratchs.
