印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
12期
55-58
,共4页
板边插头%电镀镍金%析氢反应%渗金
闆邊插頭%電鍍鎳金%析氫反應%滲金
판변삽두%전도얼금%석경반응%삼금
Edge-Board Contacts%ENEG%HER%Diffusion Coating Gold
由于在电镀镍金过程中均会发生析氢反应，在镀镍金过程中，氢气的释放会攻击抗蚀材料的侧面位置，导致抗镀层侧蚀位疏松，容易出现渗镀问题。本文通过采用DOE试验优化设计以改善上述不良问题。
由于在電鍍鎳金過程中均會髮生析氫反應，在鍍鎳金過程中，氫氣的釋放會攻擊抗蝕材料的側麵位置，導緻抗鍍層側蝕位疏鬆，容易齣現滲鍍問題。本文通過採用DOE試驗優化設計以改善上述不良問題。
유우재전도얼금과정중균회발생석경반응，재도얼금과정중，경기적석방회공격항식재료적측면위치，도치항도층측식위소송，용역출현삼도문제。본문통과채용DOE시험우화설계이개선상술불량문제。
Due to the problem happening in the process of gold plating nickel chemical reaction, during the hydrogen evolution reaction and in the process of nickel plating gold, the release of hydrogen attacked the corrosion resistant materials under-the cut location, which lead to the corrosion resistance of coating side loose. It is easy to have a plating issue. In this paper, through the adoption of DOE test optimization design, it is to improve the bad problems.
