CAJ | 학술논문

文章主要阐述HDI电路板在电镀填孔制作中的一种填铜新工艺，经垂直沉铜后取消闪镀，直接进行填铜。用正交表L16(45)安排不同介质厚度、浸酸时间、浸酸浓度、三因素进行电镀试验，进行综合分析得到了填铜的最佳参数。
문장주요천술HDI전로판재전도전공제작중적일충전동신공예，경수직침동후취소섬도，직접진행전동。용정교표L16(45)안배불동개질후도、침산시간、침산농도、삼인소진행전도시험，진행종합분석득도료전동적최가삼수。
This article mainly describes a new hole iflling plating process in HDI PCB which cancel the lfash plating and implement hole iflling process directly after electroless copper plating. This test uses orthogonal experiment and arrange experiment with the L16(45) orthogonal table. Select the thickness of dielectric layer, pickling time, acid concentration as factors, pore-iflling ratio is selected as the experimental electroplating index. After a comprehensive analysis, the optimal parameter is obtained.