印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
12期
10-13
,共4页
薄布基材%任意层互连板%应力%板弯翘
薄佈基材%任意層互連闆%應力%闆彎翹
박포기재%임의층호련판%응력%판만교
Thin Cloth Substrate%ELIC%Tensile Stress%Warpage
由于近几年移动通讯类产品向轻、薄的迅猛发展，而承载部件主板的重量、厚度、体积等起到决定性的作用，故适合此类产品的新型材料薄布基材应用而生，本文主要阐述PCB制造端对板弯翘的预防、改善及矫正方法。
由于近幾年移動通訊類產品嚮輕、薄的迅猛髮展，而承載部件主闆的重量、厚度、體積等起到決定性的作用，故適閤此類產品的新型材料薄佈基材應用而生，本文主要闡述PCB製造耑對闆彎翹的預防、改善及矯正方法。
유우근궤년이동통신류산품향경、박적신맹발전，이승재부건주판적중량、후도、체적등기도결정성적작용，고괄합차류산품적신형재료박포기재응용이생，본문주요천술PCB제조단대판만교적예방、개선급교정방법。
Due to the mobile communication products are developing rapidly towards lighter and thinner in recent years, and the main board as the main loading parts, whose weight, thickness and volume are playing the decisive roles, the application of new materials such like thin cloth substrate come into being. This article mainly elaborated the prevention and improvement correction method against warpage in PCB manufacturing.
