CAJ | 학술논문

随着电子产品的发展，电路板的设计朝着高密度化和薄型化的方向发展，任意层HDI板更多的应用于高端智能产品中。对于任意层HDI板，其对准度直接影响到任意层HDI板的良率及公司的市场竞争力。文章概述了现有的任意层HDI板对位系统，并对其对位系统进行了优化。
수착전자산품적발전，전로판적설계조착고밀도화화박형화적방향발전，임의층HDI판경다적응용우고단지능산품중。대우임의층HDI판，기대준도직접영향도임의층HDI판적량솔급공사적시장경쟁력。문장개술료현유적임의층HDI판대위계통，병대기대위계통진행료우화。
With the development of electronic products, and circuit board design towards high density and thin direction, the design of the circuit board is toward the direction of high density and thin, so anylayer HDI boards has been used more and more popular in high-end smart products. For anylayer HDI boards, the registration accuracy directly affects the yield and the company's competitiveness. This paper summarizes the existing registration system, and optimized the system.