印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
12期
5-6,34
,共3页
任意层互连%盲孔叠孔%对准度%涨缩
任意層互連%盲孔疊孔%對準度%漲縮
임의층호련%맹공첩공%대준도%창축
Any Layer%Blind Stack Via%Registration%Swell&Shrink
任意层互连（ELIC）是最高阶的高密度连接（HDI）制程，它可以比传统线路在层数相同的情况下，增加约30%层间互连；随着移动通讯产品功能需求的增加，ELIC技术被大举应用在智能手机及平面电脑等产品上。高阶ELIC线路板的生产不但流程长，且生产难度较大。本文对ELIC板的制作难点进行了分析，并提出相应的解决方法和生产注意事项，为ELIC工艺产业化提供必要的参考依据。
任意層互連（ELIC）是最高階的高密度連接（HDI）製程，它可以比傳統線路在層數相同的情況下，增加約30%層間互連；隨著移動通訊產品功能需求的增加，ELIC技術被大舉應用在智能手機及平麵電腦等產品上。高階ELIC線路闆的生產不但流程長，且生產難度較大。本文對ELIC闆的製作難點進行瞭分析，併提齣相應的解決方法和生產註意事項，為ELIC工藝產業化提供必要的參攷依據。
임의층호련（ELIC）시최고계적고밀도련접（HDI）제정，타가이비전통선로재층수상동적정황하，증가약30%층간호련；수착이동통신산품공능수구적증가，ELIC기술피대거응용재지능수궤급평면전뇌등산품상。고계ELIC선로판적생산불단류정장，차생산난도교대。본문대ELIC판적제작난점진행료분석，병제출상응적해결방법화생산주의사항，위ELIC공예산업화제공필요적삼고의거。
Any Layer Interconnection (ELIC) is the highest level of high-density connection (HDI) process. Compared with the traditional lines under the same condition of the layer number, ELIC can increased about 30%interconnection between the layers. With the development of mobile communications products, ELIC Technology is used in smart-phones and tablets and other products. High level ELIC Circuit board production not only has a long process but also has production dififculty. At present, just only a few circuit board companies grasp the skill. In this paper, it analyzed the dififculties of ELIC production, and provided corresponding solutions or production considerations. It can provide the necessary reference for ELIC technology industrialization.
