CAJ | 학술논문

报道了一种高效节能、千瓦级光纤柔性输出半导体激光焊接光源。采用半导体激光合束技术,研制出2246W半导体激光合束光源,电光效率达43.6％；通过聚焦耦合,实现从600μm芯径、数值孔径0.2的光纤连续输出功率为2104W,光纤耦合效率达93.7％；在光纤输出端采用放大率1﹕1的成像系统,到达工件表面的功率为2084W,光参量积为46.89mm·mrad,在束腰处测得光斑直径600μm,光功率密度为7.37Χ105 W/cm2,可以满足金属薄板焊接的激光加工要求。
보도료일충고효절능、천와급광섬유성수출반도체격광한접광원。채용반도체격광합속기술,연제출2246W반도체격광합속광원,전광효솔체43.6％；통과취초우합,실현종600μm심경、수치공경0.2적광섬련속수출공솔위2104W,광섬우합효솔체93.7％；재광섬수출단채용방대솔1﹕1적성상계통,도체공건표면적공솔위2084W,광삼량적위46.89mm·mrad,재속요처측득광반직경600μm,광공솔밀도위7.37Χ105 W/cm2,가이만족금속박판한접적격광가공요구。
A fiber-coupled kW-class semiconductor laser for welding with high efficiency was reported. By adop_ting the laser beam combining technology, semi-conductor laser with output power of 2246W and wall-plug efficiency of 43. 6% was developed. Then through foucusing and coupling, output power of 2104W was obtained from a fiber with core diameter of 600μm and numerical aperture of 0 . 2 . The coupling efficiency reached 93 . 7%. At the end of the fiber, an imaging system with the magnification of 1 was used and the final laser power on the workpiece surface was 2084W. The beam parametric product of the laser was 46. 89mm·mrad and the spot diameter at the beam waist was 600μm. The power density was 7. 37Χ105 W/cm2 which could satisfy the requirement of the sheet metal welding.