电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
1期
96-99
,共4页
刘培生%黄金鑫%卢颖%杨龙龙
劉培生%黃金鑫%盧穎%楊龍龍
류배생%황금흠%로영%양룡룡
MOSFET%仿真%TO-263器件%可靠性%疲劳寿命%失效
MOSFET%倣真%TO-263器件%可靠性%疲勞壽命%失效
MOSFET%방진%TO-263기건%가고성%피로수명%실효
MOSFET%simulation%TO-263 device%reliability%fatigue life%failure
通过ANSYS有限元分析软件对TO-263器件功率MOSFET管进行电-热-机械耦合分析,并对其热疲劳寿命作出预测。首先进行了瞬态热分析,得出了芯片的热通量变化图,在此基础上进行模拟并通过 Coffin-Manson定律预测功率MOSFET管的热疲劳寿命。结果表明,TO-263器件功率MOSFET管的热疲劳失效循环总数为6113。
通過ANSYS有限元分析軟件對TO-263器件功率MOSFET管進行電-熱-機械耦閤分析,併對其熱疲勞壽命作齣預測。首先進行瞭瞬態熱分析,得齣瞭芯片的熱通量變化圖,在此基礎上進行模擬併通過 Coffin-Manson定律預測功率MOSFET管的熱疲勞壽命。結果錶明,TO-263器件功率MOSFET管的熱疲勞失效循環總數為6113。
통과ANSYS유한원분석연건대TO-263기건공솔MOSFET관진행전-열-궤계우합분석,병대기열피로수명작출예측。수선진행료순태열분석,득출료심편적열통량변화도,재차기출상진행모의병통과 Coffin-Manson정률예측공솔MOSFET관적열피로수명。결과표명,TO-263기건공솔MOSFET관적열피로실효순배총수위6113。
Electric thermal mechanical coupling analysis of TO-263 power MOSFET tube was implemented by using ANSYS FEM analysis software and the tube’s thermal fatigue life was predicted. Firstly, the transient thermal analysis was carried out and the thermal flux variation graph was achieved, then the simulation was realized and the thermal fatigue life of power MOSFET tube was predicted through the Coffin-Manson's law. Results show that the total cycle sum of the thermal fatigue failure of TO-263 power MOSFET tube is 6 113.